Manufacture method for plugging resin into soft and hard combined circuit board

Abstract

The invention discloses a manufacture method for plugging resin into a soft and hard combined circuit board, and relates to the technical field of circuit board production. The method comprises that S1) an internal circuit pattern is prepared in both a soft core board and a hard core board, and corresponding drilling positions of the circuit pattern are provided with isolated pads whose aperture is greater than that of a drill hole; S2) the soft core board and the hard core board are compressed by PP to form the soft and hard combined circuit board; S3) the drill hole into which resin needs to be plugged is drilled in the soft and hard combined circuit board; S4) copper deposition and electroplating are carried out on the inner wall of the drill hole; S5) the electroplated drill hole is filled with the resin, and the resin is solidified initially; and S6) and residual resin flowing out of the copper surface of the soft and hard combined circuit board is polished by a polishing plate. The isolated pads of the internal circuit in the drilling pole positions are reserved, the thickness of the drilling hole positions is ensured, the problem that the copper surface at the through hole position is recessed caused by low filling capability of NO-FLOW PP used in the soft and hard combined circuit board is solved, and rework of manual polishing due to the fact that the resin polishing plate is not clean is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a resin plug hole of a soft-hard combination circuit board. Background technique [0002] In the design of flexible and rigid circuit boards, due to the limitation of product design and wiring space, vias are provided under some surface pads. In order to ensure the soldering quality of components on the surface pads, the vias under the surface pads need to be applied to plugs Hole process to ensure the flatness of the surface pad. [0003] Resin ink plugging is the most commonly used plugging process at present. After making the inner layer graphics, pressing, drilling, and graphic plating, the via holes are filled with resin ink by screen or aluminum sheet printing, and after baking and curing, the abrasive belt grinder grinds off the resin overflowing the copper surface and removes it. Level the surface of the plate, and then sink t...

AI Technical Summary

Problems solved by technology

[0005] like figure 2 As shown, when making the inner layer pattern, the solder pad corresponding to the via hole 26 of the inner layer copper layer 24 is etched away, and the NO-FLOWPP glue used for the lamination of the soft and hard combined circuit board has poor fluidity, and the via hole 26 after pressing The copper-free position of the corresponding inner layer copper layer 24 is filled by the adjacent first base material 21 and the second base material 22, thereby causing the surface of the corresponding position of the first base copper 23 on the surface of the first base material 21 and the second base copper on the surface of the second base material 22. The corresponding position of the dibase copper 25 is depressed; after drilling, the graphic plated hole will be plated with a certain thickness of copper on the surface near the via hole 26, and the copper plating 27 on the surface forms an annular groove 29 with the depression on the surface, and The groove 29 is difficult to be polished and smooth. After the resin 28 plugs the hole, the resin 28 overflowing into the groove 29 is difficult to remove through the abrasive belt grinding plate, and manual grinding is required, which consumes a lot of labor and time.

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