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Metal-resin compound and preparation method thereof

A composite and metal matrix layer technology, applied in the direction of metal layered products, chemical instruments and methods, synthetic resin layered products, etc., can solve the problem of low bonding strength and achieve high bonding strength, good applicability, and high structure The effect of stability

Active Publication Date: 2015-12-30
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the technical problem that the bonding strength between the resin layer and the copper or copper alloy substrate is not high in the existing copper or copper alloy-resin composite body, and to provide a copper or copper alloy-resin composite body And preparation method thereof, in the copper or copper alloy-resin prepared by the method of the present invention, there is higher bonding strength between the resin layer and the copper or copper alloy substrate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] (1) A commercially available brass plate with a thickness of 1 mm was cut into rectangular pieces of 15 mm×80 mm. Put the rectangular piece into the polishing machine for polishing. Then it was washed with absolute ethanol, then soaked in an aqueous solution of sodium hydroxide with a concentration of 2% by weight, taken out after 2 minutes and rinsed with deionized water to obtain a pretreated brass sheet.

[0061] (2) the brass sheet that step (1) is obtained is put into as anode with the aqueous solution that contains the NaOH of 20% by weight and the sodium molybdate of 1% by weight in the anodizing tank as electrolytic solution, with graphite carbon plate as cathode , at 60°C for 5 minutes at a voltage of 15V for anodic oxidation. The anodized brass sheet is taken out and dried to obtain a brass substrate with an anodized film layer on the surface. It was determined that the thickness of the anodized film layer was 8 μm.

[0062] (3) the brass base material that...

Embodiment 2

[0078] (1) The brass sheet was prepared in the same manner as in step (1) of Example 1.

[0079] (2) Adopt the same method as embodiment 1 step (2) to form an anodic oxide layer on the surface of the brass sheet, the difference is that the electrolyte does not contain sodium molybdate, and the electrolysis time is 8 minutes. It was determined that the thickness of the anodized film layer was 8 μm.

[0080] (3) the brass base material that the surface that step (2) obtains has the anodic oxidation film layer is after the hydrochloric acid of 20 ℃ concentration is 30% by weight soaks for 10 minutes, takes out and soaks in water for 1 minute, then takes out the blower Dry to obtain a surface-treated brass substrate.

[0081] It has been determined that corrosion holes with a pore diameter in the range of 800-1500nm are distributed in the anodized film layer of the surface-treated brass substrate, and the ratio of the depth of the corrosion holes to the thickness of the anodized ...

Embodiment 3

[0084] (1) The brass sheet was prepared in the same manner as in step (1) of Example 1.

[0085] (2) Form an anodized film layer on the surface of the brass sheet prepared in step (1) by the same method as in step (2) of Example 1, thereby obtaining a brass substrate with an anodized film layer on the surface.

[0086] (3) adopt the method identical with embodiment 1 step (3) to carry out chemical etching to the brass base material that the surface has anodized film layer, difference is, etching solution also contains NaCl, and the mol ratio of NaCl and HCl is 1: 1, so as to obtain a surface-treated brass substrate.

[0087] It has been determined that corrosion holes with a pore diameter in the range of 1000-1500nm are distributed in the anodized film layer of the surface-treated brass substrate, and the ratio of the depth of the corrosion holes to the thickness of the anodized film layer is 0.2-0.4:1 In the range.

[0088] (4) Adopt the method identical with embodiment 1 s...

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Abstract

The invention provides a metal-resin compound and a preparation method thereof and discloses a copper / copper alloy-resin compound and a preparation method thereof. The preparation method comprises the following steps: providing a metal base material comprising a metal matrix layer and an oxide film layer attached to the partial surface of the metal matrix layer; carrying out chemical etching on the metal base material to form corrosion holes in the surface of the metal matrix layer so as to obtain a metal base material subjected to surface treatment; injecting a composition containing resin to the surface of the metal base material subjected to surface treatment and enabling the corrosion holes to be filled with the partial composition so as to form a resin layer after forming. In the metal-resin compound, the bonding strength between the resin and the metal base material is high, and the resin layer is unlikely to fall off from the surface of the metal base material, so that relatively high structure stability is realized and requirements of use occasions for relatively high structure stability can be met. The preparation method provided by the invention is good in applicability, and can combine various resins with the metal base material so as to meet requirements of various use occasions.

Description

technical field [0001] The invention relates to a metal-resin composite body and a preparation method thereof, more particularly, the invention relates to a copper or copper alloy-resin composite body and a preparation method thereof. Background technique [0002] Metal-resin integrated molding technology is required in the field of parts manufacturing for automobiles, home appliances, and industrial machines. [0003] The commonly used method of combining metal and resin is gluing technology. This method combines metal and shaped resin with a chemical adhesive to create a composite body. However, in the composite body obtained by this method, the bonding strength between the metal and the resin is poor, and the adhesive bonding layer is not resistant to acid and alkali, which affects the application occasion of the composite body. In addition, since the adhesive bonding layer has a certain thickness, it will affect the size of the final product. [0004] In view of the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B15/08B32B27/06C25D11/34C23F1/18
CPCB32B15/08B32B15/20B32B27/20B32B2262/101B32B2307/542B32B2307/714C23F1/00C23F1/18C25D11/34
Inventor 孙剑吴彦琴张云侠陈梁
Owner BYD CO LTD
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