Nanometer core-shell rubber particle toughening epoxy resin compound and preparation method of nanometer core-shell rubber particle toughening epoxy resin compound

Abstract

The invention provides a nanometer core-shell rubber particle toughening epoxy resin compound and a preparation method of the nanometer core-shell rubber particle toughening epoxy resin compound. The compound comprises epoxy resin, nanometer core-shell rubber particles, a silane coupling agent and an optional diluting agent, wherein the epoxy resin accounts for 39 percent to 84 percent of the weight of the compound; the content of the nanometer core-shell rubber particles accounts for 8.4 percent to 23.4 percent of the weight of the epoxy resin; the silane coupling agent is added into the compound in a form of being coated onto the surfaces of the nanometer core-shell rubber particles; the content of the silane coupling agent accounts for 1 percent to 10 percent of the weight of the nanometer core-shell rubber particles. The nanometer core-shell rubber particle toughening epoxy resin compound has the advantages that the dispersing effect is good; in addition, the storage stability is good; when the compound is used as a toughening agent to be added into an epoxy resin composition for preparing copper cladded plates, the toughness of epoxy resin curing materials can be improved, so that the copper cladded plates with excellent toughness and flexibility can be prepared.

Description

technical field [0001] The invention relates to an epoxy resin compound toughened by nano core-shell rubber particles and a preparation method thereof. Background technique [0002] Copper clad laminate (copper clad laminate, referred to as CCL) is made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with epoxy resin, coated with copper foil on one or both sides, and formed by hot pressing. Copper-clad laminates are the basic materials of the electronics industry and are mainly used for processing and manufacturing printed circuit boards (PCBs). With the miniaturization and thinning of printed circuit boards, copper clad laminates with excellent flexibility are required. [0003] Nanomaterials are one of the most advanced research fields in today's world technology. The high-strength and high-toughness polymer-based composites can be obtained by adding nanoparticle / fiber mesh modification technology, which has always been a hot spot of common...

AI Technical Summary

Problems solved by technology

[0005] Adding nano-rubber particles with core-shell structure to epoxy resin can improve the strength and flexibility of epoxy resin. However, since the nano-rubber particles with core-shell structure are difficult to disperse in epoxy resin, it may cause particles Uneven dispersion, which affects the overall resin performance

In the later stage, it is hoped to adopt the process of high-speed dispersion and grinding, but uniform dispersion cannot be achieved