Brazing ball machining device enabling size of brazing balls to be controllable and machining method

Abstract

A brazing ball machining device enabling the size of brazing balls to be controllable comprises a wire feed device, a wire cutting device and a heating and cooling device, wherein the wire feed device, the wire cutting device and the heating and cooling device are sequentially arranged from top to bottom in the vertical direction. The wire feed device comprises a brazing wire scroll, a wire feed roller, a locating device and a brazing wire length control device. The wire cutting device comprises a blade and a liner plate, the liner plate is provided with a reciprocating drive mechanism, and the blade is installed on the reciprocating drive mechanism. The heating and cooling device comprises a heating and cooling pipe with a heating part and a cooling part. A method machining the brazing balls through the device comprises the steps of heating, wire feeding, wire cutting, balling, cleaning, drying, inspecting and the like. According to the invention, the brazing wire length control device measures the wire cutting length accurately and the wire cutting device cuts wires accurately to control the diameter of the brazing balls, and therefore the size of the machined brazing balls can be more uniform; the requirements of the high-density assembly technology can be met, the automation degree is higher and the machining efficiency is higher.

Description

technical field [0001] The invention relates to the technical field of processing equipment for microelectronic materials, in particular to a solder ball processing device and a processing method for ball grid array packaging that can control the size of solder balls. Background technique [0002] At present, with the rapid development of electronic products in the direction of portability, miniaturization, networking and multimedia, higher requirements are placed on electronic assembly technology, and new high-density assembly technologies are emerging, among which ball grid array packaging (BGA: BallGridArray) is a high-density assembly technology that has been matured and used. Among these packaging technologies, soldering balls are the key materials for electronic packaging; foreign research on soldering balls is relatively mature, and soldering balls of various specifications can already be produced. balls to meet the needs of electronic packaging, but there are few dom...

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Problems solved by technology

[0002] At present, with the rapid development of electronic products in the direction of portability, miniaturization, networking and multimedia, higher requirements are placed on electronic assembly technology, and new high-density assembly technologies are emerging, among which ball grid array packaging (BGA: BallGridArray) is a high-density assembly technology that has been matured and used. Among these packaging technologies, soldering balls are the key materials for electronic packaging; foreign research on soldering balls is relatively mature, and soldering balls of various specifications can already be produced. balls to meet the needs of electronic packaging, but there are few domestic researches. Jiang Yi from Shanghai, China applied for a patent "Manufacturing Method of Low-Silver Solder Balls" (9511332.2), which is only applicable to low-power soldering of high-power tube heat sinks. The manufacture of silver solder balls is produced by cutting and sintering; Beijing Zhang Daoguang applied for the manufacturing method of solder balls for electronic packaging. This patent is to generate solder balls by melting wires and falling off by gravity. Precise control, and the size of solder balls is generally large, which does not meet the requirements of high-density assembly technology, resulting in China's demand for solder balls relying on imports, increasing the production cost of China's electronic products, and seriously restricting the development of China's chip manufacturing industry

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