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A metal-ceramic composite substrate and its preparation process

A metal-ceramic composite and preparation technology, which is applied in the field of electronic packaging materials, can solve the problems of insufficient thermal matching of heat dissipation substrates and difficult to meet costs, and achieve the effects of natural fiber distribution, low efficiency and high efficiency

Active Publication Date: 2018-01-30
SHANTOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a metal-ceramic composite substrate to solve the problems of insufficient thermal matching of current heat dissipation substrates or difficulty in meeting the requirements of high-power electronic packaging substrates.

Method used

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  • A metal-ceramic composite substrate and its preparation process
  • A metal-ceramic composite substrate and its preparation process
  • A metal-ceramic composite substrate and its preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Weigh nanometer Al according to volume percentage 2 o 3 50 parts of ceramic powder, 10 parts of copper fiber, ZnO-B with a melting point of 620°C 2 o 3 -SiO 2 40 parts of glass sintering aids, uniformly mixed into a mixed powder; then weigh 70% of the mixed powder, 14% of water, 9% of polyvinyl butyral, 6% of polyethylene glycol, three oils Glyceride 0.5%, defoaming agent 0.01%, film-forming aid 0.5%, ball milling and mixing for 48 hours, and the ball-milled cast slurry is vacuum defoamed under the condition of vacuum degree -0.1Mpa by a vacuum pump to eliminate ball milling The air mixed with the slurry; then the slurry treated by vacuum defoaming is tape-cast on a tape casting machine to form a 0.5mm thick ceramic green tape, and then dried; the dried ceramic green tape is sliced ​​and sent to the row In the glue furnace, raise the temperature to 500°C, keep it for 1 hour, and get the ceramic green sheet after debinding; put the ceramic green sheet into the nitrog...

Embodiment 2

[0039] According to volume percentage, weigh 30 parts of cordierite ceramic powder, 40 parts of copper-zinc alloy fiber, commercially available ZnO-B with a melting point of 800°C 2 o 3 -SiO 230 parts of glass sintering aids, mixed uniformly to form a mixed powder; according to the mass percentage, weigh 62% of the mixed powder, 13% of water, 18% of polyvinyl butyral, 6% of polyethylene glycol, trioleic acid Glyceride 0.5%, defoamer 0.01%, film-forming aid 0.5% Weigh raw materials, ball mill and mix for 36 hours to prepare cast slurry; the ball-milled cast slurry is vacuum pumped at a vacuum degree of -0.1Mpa Carry out vacuum degassing under the conditions to eliminate the air mixed into the slurry in the ball mill; then cast the slurry treated by vacuum degassing on a tape casting machine; form a 3mm thick ceramic green belt, and then dry it; the dried The ceramic raw tape is sliced ​​and sent to the debinding furnace, debinding in sections, heated to a temperature of 500°C...

Embodiment 3

[0041] Weigh Al according to volume percentage 2 o 3 35 parts of ceramic powder, 30 parts of aluminum fiber, commercially available ZnO-B with a melting point of 650°C 2 o 3 -SiO 2 35 parts of glass sintering aids, fully mixed evenly, weighed 50% of powder, 12% of water, 28% of polyvinyl butyral, 5.4% of polyethylene glycol, 1% of glyceryl trioleate, 0.1% of defoaming agent, 0.5% of film-forming aid, ball milling and mixing for 24 hours to prepare cast slurry, and vacuum defoaming of the ball-milled cast slurry by vacuum pump under the condition of vacuum degree -0.1Mpa to eliminate The air of the slurry is mixed in the ball mill; then the vacuum degassed slurry is cast on a tape casting machine to form a 2.5mm thick ceramic green tape, and then dried; the dried ceramic green tape is sliced ​​and sent to the In the debinding furnace, degumming is performed in sections, the temperature is raised to 500°C, and kept for 1 hour, and the ceramic green sheet is obtained after de...

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Abstract

The invention relates to a metal-ceramic composite base plate and a preparation technology of the same. The metal-ceramic composite base plate includes three phases: ceramic, glass and metal, wherein the ceramic phase and the glass phase are uniformly mixed and distributed to form a ceramic base body. The metal phase is formed through melting or semi-melting of metal fibers. The metal phases are welded to each other to form three-dimensional network heat-dissipation channels which are connected and penetrated to each other in the ceramic base body. The preparation technology includes the steps of mixing a ceramic powder, metal fibers and a low-temperature glass sintering aid, adding a solvent, a binding agent, a dispersion agent, a plasticizer agent, a defoaming agent and a film-forming aid, performing ball-milling and mixing to obtain a homogeneous mixture, performing vacuum defoamation and tape casting, drying a product, removing glue and finally performing sintering. The base plate is greatly improved in heat dissipation capability on the premise of ensuring a high heat-matching performance. By means of the tape casting and the low-temperature sintering processes, the invention solves the problems that a pressure casting or pressure infiltration device is low in efficiency, wetting between metal and ceramic is difficult, and the metal phase is not continuous in connection in the base plate.

Description

technical field [0001] The invention relates to a high thermal conductivity composite ceramic substrate, which belongs to the field of electronic packaging materials. Background technique [0002] The heat dissipation substrate is an important basic support component in electronic packaging. Currently, commonly used heat dissipation substrate materials include PCB, silicon, metal (such as aluminum, copper), ceramics (such as Al 2 o 3 , AlN, SiC) and composite materials, etc. The thermal conductivity of the traditionally used PCB package base is only about 0.36W / mK, which is far from meeting the heat dissipation requirements of high-power electronic package substrates. Due to the disadvantages of difficult processing and high cost of silicon material substrates, it is also difficult to meet the requirements of high-power electronic packaging substrates. The single metal material (mainly Al, Cu) substrate does not match the chip due to its thermal expansion coefficient. For...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/76C04B35/63
Inventor 王双喜王文君张丹
Owner SHANTOU UNIV
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