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Preparation method of radiation-resistant organic silicon packaging adhesives

A silicone and encapsulant technology, used in adhesives, adhesive types, adhesive additives, etc., can solve problems such as poor radiation resistance, reduce radiation energy, improve compatibility, and reduce surface energy. Effect

Inactive Publication Date: 2015-11-25
DONGGUAN XINXING ORGANIC SILICON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The silicone encapsulant does not contain organic solvents, is environmentally friendly, and the cured product is colorless and transparent, with a light transmittance of over 94% and a refractive index of 1.432. However, it has the same durability as the existing silicone encapsulant. Problems with Poor Irradiation Performance

Method used

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  • Preparation method of radiation-resistant organic silicon packaging adhesives

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The preparation method of radiation-resistant organic silicon encapsulation glue, its steps are as follows:

[0025] (1) Disperse titanate coupling agent in n-butanol aqueous solution with a mass fraction of 80%, stir at room temperature for 40 minutes to obtain a modified solution, add nano-cerium oxide to the modified solution and stir magnetically for 2 hours at 70°C , condensed and refluxed for 1 hour, then decompressed and rotary evaporated for 30 minutes, moved to a vacuum drying oven and dried to constant weight, removed and ground to obtain modified nano-cerium oxide, wherein the weight of titanate coupling agent was 9% of nano-cerium oxide. %;

[0026] (2) In parts by weight, 100 parts of polyphenylmethylsiloxane, 10.5 parts of PEEK, 3 parts of ethyl methacrylate and 0.9 parts of modified nano-cerium oxide obtained in step (1) are added in the internal mixer The temperature is 210°C, the speed is 100rpm, blending for 10 minutes, moving to the single-screw extr...

Embodiment 2

[0029] The preparation method of radiation-resistant organic silicon encapsulation glue, its steps are as follows:

[0030] (1) Disperse titanate coupling agent in n-butanol aqueous solution with a mass fraction of 80%, stir at room temperature for 40 minutes to obtain a modified solution, add nano-cerium oxide to the modified solution and stir magnetically for 2 hours at 70°C , condensed and refluxed for 1 hour, then decompressed and rotary evaporated for 30 minutes, moved to a vacuum drying oven and dried to constant weight, removed and ground to obtain modified nano-cerium oxide, wherein the weight of titanate coupling agent was 9% of nano-cerium oxide. %;

[0031] (2) In parts by weight, 100 parts of polyphenylmethylsiloxane, 10 parts of PEEK, 3.6 parts of ethyl methacrylate and 1. part of modified nano-cerium oxide obtained in step (1) are added to the internal mixer The medium temperature is 210°C and the speed is 100rpm, blending for 10 minutes, moving to a single-scre...

Embodiment 3

[0034] The preparation method of radiation-resistant organic silicon encapsulation glue, its steps are as follows:

[0035] (1) Disperse titanate coupling agent in n-butanol aqueous solution with a mass fraction of 80%, stir at room temperature for 40 minutes to obtain a modified solution, add nano-cerium oxide to the modified solution and stir magnetically for 2 hours at 70°C , condensed and refluxed for 1 hour, then decompressed and rotary evaporated for 30 minutes, moved to a vacuum drying oven and dried to constant weight, removed and ground to obtain modified nano-cerium oxide, wherein the weight of titanate coupling agent was 9% of nano-cerium oxide. %;

[0036] (2) In parts by weight, 100 parts of polyphenylmethylsiloxane, 11 parts of PEEK, 3.2 parts of ethyl methacrylate and 1 part of modified nano-cerium oxide obtained in step (1) are added in the internal mixer The temperature is 210°C, the speed is 100rpm, blending for 10 minutes, moving to the single-screw extrude...

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Abstract

The invention provides a preparation method of radiation-resistant organic silicon packaging adhesives. The method includes the following steps that (1) a titanate coupling agent is dispersed in an n-butanol aqueous solution with the mass fraction being 80%, modified liquid is obtained after room-temperature stirring, nano cerium oxide is added into the modified liquid for magnetic stirring, pressure reduction and rotary evaporation are carried out on the mixture after reflux condensation, the mixture is dried till the weight is constant, the mixture is obtained and ground, and accordingly modified nano cerium oxide is obtained; (2) by mass, poly (methyl phenyl siloxane), PEEK, ethyl methacrylate and the modified nano cerium oxide obtained in the step (1) are added into an internal mixer for mixing, the mixture is moved into a single-screw extruding machine to be melted and extruded, and a granular material is obtained after cooling and granulation; (3) by weight, a cross-linking agent, a tackifier and the particle material obtained in the step (2) are added into a high mixing machine for high-speed mixing, high-speed mixing continuous being carried out after an inhibitor is added, medium-speed mixing is carried out after a catalyst is added, and the radiation-resistant organic silicon packaging adhesives are obtained after discharging. The organic silicon packaging adhesives prepared through the method are good in radiation resistance.

Description

technical field [0001] The invention relates to encapsulation glue, in particular to a preparation method of radiation-resistant organic silicon encapsulation glue. Background technique [0002] In the past, epoxy resin was mostly used as the packaging material for LED packaging. However, with the advancement of LED technology, epoxy resin can no longer meet the requirements of high-power LED packaging due to its shortcomings such as easy yellowing at high temperatures and poor UV resistance. Organic Silicone resin has the advantages of excellent thermal stability, flexibility, water resistance, weather resistance, flame retardancy and low surface energy, making it an ideal material for LED packaging. With the continuous advancement of LED technology, the application of silicone encapsulants is becoming more and more extensive, and there are more and more applications in environments with high radiation. In this case, radiation will cause the aging of silicone encapsulants ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J161/16C09J11/04C09J11/06H01L33/56
Inventor 吴细飞
Owner DONGGUAN XINXING ORGANIC SILICON TECH
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