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Titanium nitride ceramic substrate for LED

A titanium nitride ceramic and titanium nitride technology, which is applied in the field of titanium nitride ceramic substrates for LEDs, can solve the problems of high-power LED LED luminous efficiency attenuation and life expectancy, and achieve enhanced ceramic performance, improved density, and reduced costs. Effect

Inactive Publication Date: 2015-10-21
长沙鼎成新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has been paid more and more attention (too high temperature will lead to the attenuation of LED luminous efficiency); fatal impact

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A titanium nitride ceramic substrate for LED, which is made of the following components and parts by weight: 70 parts of titanium nitride; 15 parts of aluminum nitride; 15 parts of aluminum oxide; 15 parts of yttrium oxide; 15 parts of silicon carbide; natural zeolite 15 parts; 7 parts of glass sintering aid; 7 parts of copper nanoparticles; 7 parts of organic solvent; 1 part of plasticizer; 1 part of dispersant; 1 part of binder; 1 part of toughening fiber;

[0022] The weight composition of the glass sintering aid is: 70 parts of silicon oxide; 10 parts of boron oxide; 10 parts of beryllium oxide; 10 parts of calcium oxide; 5 parts of magnesium oxide; 5 parts of aluminum oxide; 3 parts of phosphorus pentoxide; 3 copies;

[0023] Described organic solvent is acetone, isopropanol binary mixed organic solvent system;

[0024] The dispersant is a PEG dispersant;

[0025] Described binder is PVB binder;

[0026] The particle size of the copper nanoparticles is 50nm, and...

Embodiment 2

[0033] A titanium nitride ceramic substrate for LED, made of the following components and their weight parts: 70 parts of titanium nitride; 18 parts of aluminum nitride; 18 parts of aluminum oxide; 18 parts of yttrium oxide; 18 parts of silicon carbide; natural zeolite 18 parts; 8 parts of glass sintering aid; 8 parts of copper nanoparticles; 8 parts of organic solvent; 1 part of plasticizer; 1 part of dispersant; 1 part of binder; 1 part of toughening fiber;

[0034] The weight composition of the glass sintering aid is: 70 parts of silicon oxide; 10 parts of boron oxide; 10 parts of beryllium oxide; 10 parts of calcium oxide; 5 parts of magnesium oxide; 5 parts of aluminum oxide; 3 parts of phosphorus pentoxide; 3 copies;

[0035] Described organic solvent is acetone, isopropanol binary mixed organic solvent system;

[0036] The dispersant is a PEG dispersant;

[0037] Described binder is PVB binder;

[0038] The particle size of the copper nanoparticles is 50nm, and the p...

Embodiment 3

[0045] A titanium nitride ceramic substrate for LEDs, made of the following components and parts by weight: 60 parts of titanium nitride; 19 parts of aluminum nitride; 19 parts of aluminum oxide; 19 parts of yttrium oxide; 19 parts of silicon carbide; natural zeolite 19 parts; 8 parts of glass sintering aid; 8 parts of copper nanoparticles; 8 parts of organic solvent; 2 parts of plasticizer; 2 parts of dispersant; 2 parts of binder; 2 parts of toughening fiber;

[0046] The weight composition of the glass sintering aid is: 70 parts of silicon oxide; 10 parts of boron oxide; 10 parts of beryllium oxide; 10 parts of calcium oxide; 5 parts of magnesium oxide; 5 parts of aluminum oxide; 3 parts of phosphorus pentoxide; 3 copies;

[0047] Described organic solvent is acetone, isopropanol binary mixed organic solvent system;

[0048] The dispersant is a PEG dispersant;

[0049] Described binder is PVB binder;

[0050] The particle size of the copper nanoparticles is 50nm, and the...

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PUM

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Abstract

The invention discloses a titanium nitride ceramic substrate for an LED. According to the titanium nitride ceramic substrate, various raw materials in the LTCC preparation process are optimized, titanium nitride is used as the main raw material, aluminum nitride, aluminum oxide, yttrium oxide and natural zeolite are added in a supplementary mode and used as the main raw materials, addition agents such as glass sintering aids, copper nanometer particles, solvent, plasticizer, dispersing agents, bonding agents and toughened fibers are added, and then the physical and chemical performance of the ceramic substrate is optimized. The thermal conductivity of the ceramic substrate is larger than 800W / (m.k), bending strength is larger than 400 MPa, and the dielectric constant is smaller than 2; meanwhile, by means of a conventional LTCC preparing method, the main raw materials and the addition agents can be prepared into the ceramic substrate with the high conductivity, and the preparation process is simple and beneficial for industrialization.

Description

technical field [0001] The invention belongs to the field of substrates for LEDs, in particular to a titanium nitride ceramic substrate for LEDs. Background technique [0002] As the fourth-generation lighting source, light-emitting diodes (LEDs) are valued by countries all over the world for their advantages such as low maintenance costs, long life, good shock resistance, low power consumption, and environmental friendliness. They are widely used in indicator lights, display screens, Backlighting, landscape lighting, transportation, etc., the market potential is huge. [0003] As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has been paid more and more attention (too high temperature will lead to the attenuation of LED luminous efficiency); Fatal impact. At present, there are four kinds of ceramic heat dissipation substrates that are more common: direct copper clad ceramic board (DBC), direct copper clad substrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/58C04B35/80C04B35/76C04B35/622
Inventor 刘贞天
Owner 长沙鼎成新材料科技有限公司
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