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High-temperature resistance organic silicon adhesive

A silicone and adhesive technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of insufficient heat resistance in adhesion and mechanical properties, and achieve fast curing speed and use Convenience, simplicity, and efficiency-enhancing effects

Active Publication Date: 2015-10-14
武汉双键新材料股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of adhesive has good heat resistance, radiation resistance, and chemical medium resistance, but there are also problems with insufficient adhesion and mechanical properties, and the heat resistance needs to be improved when used in PTC heaters.

Method used

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  • High-temperature resistance organic silicon adhesive
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  • High-temperature resistance organic silicon adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The vinyl-terminated polyorganosiloxane used in this example is a vinyl-terminated polydimethylsiloxane with a vinyl content of 2.5 wt% and a viscosity of 5000 centipoise; the reinforcing resin used is vinyl triethoxy Polysilane is a body-type vinyl-terminated polydimethylsiloxane with a vinyl content of 0.5 wt% formed by polycondensation of the core molecule with orthosilicate ethyl and ethoxytrimethylsilane, and its structural formula is:

[0024]

[0025] The toughening resin used is a mixture of octavinyl cage silsesquioxane with a vinyl content of 0.15 wt% and trapezoidal silsesquioxane with a vinyl content of 0.15 wt%; the crosslinked resin used is a hydrogen-containing 0.5% polymethylhydrogensiloxane.

[0026] Put 100 parts of vinyl-terminated polyorganosiloxane, 10 parts of reinforcing resin and 10 parts of toughening resin into a dynamic mixer and heat and stir under vacuum for 1 hour. The heating temperature is 110°C, and the vacuum degree is kept below -0....

Embodiment 2

[0032] The vinyl-terminated polyorganosiloxane used in this example is a vinyl-terminated polydimethylsiloxane with a vinyl content of 0.008 wt% and a viscosity of 15,000 centipoise; the reinforcing resin used is vinyl triethoxy Silane is a bulk vinyl-terminated polydimethylsiloxane with a vinyl content of 2.5 wt% formed by polycondensation of the core molecule with orthosilicate ethyl and ethoxytrimethylsilane, and its structural formula is:

[0033]

[0034] a mixture of the two;

[0035]The toughened resin used is a mixture of octavinyl cage silsesquioxane with vinyl content of 0.2wt% and trapezoidal silsesquioxane with vinyl content of 0.2wt%; The resin is polymethylhydrogensiloxane with a hydrogen content of 1.5 wt%.

[0036] Put 100 parts of vinyl-terminated polyorganosiloxane, 30 parts of reinforcing resin and 30 parts of toughening resin into a dynamic mixer, heat and stir in vacuum for 2 hours, the heating temperature is 110 ° C, and the vacuum degree is kept be...

Embodiment 3

[0041] The vinyl-terminated polyorganosiloxane used in this example is vinyl-terminated polydimethylsiloxane with a viscosity of 80,000 centipoise and a vinyl content of 0.008 wt %; the reinforcing resin used is vinyl triethoxy The polydimethylsiloxane with a vinyl content of 2.5% is a bulk vinyl-terminated polydimethylsiloxane formed by polycondensation of polysilane as the core molecule with ethyl orthosilicate and ethoxytrimethylsilane. Its structural formula is:

[0042]

[0043] a mixture of the two;

[0044] The toughened resin used is a mixture of octavinyl cage silsesquioxane with vinyl content of 0.2wt% and trapezoidal silsesquioxane with vinyl content of 0.2wt%; The resin is polymethylhydrogensiloxane with a hydrogen content of 1.5 wt%.

[0045] Put 100 parts of vinyl-terminated polyorganosiloxane, 15 parts of reinforcing resin and 15 parts of toughening resin into a power mixer and heat and stir under vacuum for 2 hours. The heating temperature is 80 ° C, and ...

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Abstract

The present invention relates to a high-temperature resistance organic silicon adhesive and a preparation method thereof, wherein the adhesive comprises, by weight, 100 parts of vinyl-terminated polyorganosiloxane, 10-30 parts of a reinforcing resin, 10-30 parts of a toughening resin, 2-5 parts of an antioxidant, 2-5 parts of a tackifier, 3-20 parts of a cross-linking resin, 0.005-0.1 part of a catalyst, 0.2-0.5 part of an inhibitor, 30-150 parts of a thermal conduction filler, and 3-20 parts of a temperature resistance filler. According to the present invention, the adhesive adopts the single component package so as to easily and conveniently use, no gelating or curing phenomenon is generated after storing for 12 months in the normal temperature environment, the curing can be completed by placing for 5-30 min at the temperature of 120-300 DEG C, the good high temperature aging resistance is provided after the curing, the normal temperature shear strength is reduced by less than 20% after the aging treatment for 800 h at the temperature of 450 DEG C, and the adhesive can be used for the adhesion and the curing of the heat generating ceramic in the PTC ceramic heat generating assembly and the stainless steel.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and relates to a high-temperature-resistant organic silicon adhesive, in particular to a one-component addition-type high-temperature-resistant organic silicon adhesive specially used for PTC ceramic heating components. Background technique [0002] PTC heating element is also called PTC heater, which is composed of PTC ceramic heating element and aluminum tube. Composed of heat sink, nickel-plated copper electrode terminal and PPS high temperature plastic electrode sheath. This type of PTC heater has the advantages of small thermal resistance and high heat exchange efficiency. It is an electric heater with automatic constant temperature and power saving. One of its outstanding features lies in its safety performance, that is, when the fan fails to stop, the power of the PTC heater will automatically drop sharply due to insufficient heat dissipation, and the surface temperature of the heater i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04
Inventor 黄異孙雨声雷木生
Owner 武汉双键新材料股份有限公司
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