Carbon nanotube containing PCB silver paste and preparation method thereof

Abstract

A carbon nanotube containing PCB silver paste comprises the following raw materials by weight: 55-65 parts of superfine silver powder, 10-20 parts of silver-coated glass powder, 1-2 parts of aluminum stearate, 8-10 parts of glass powder, 1-2 parts of ethylene bis oleamide, 7-10 parts of non-dry alkyd resin, 2-3 parts of polyurethane resin, 4-6 parts of acetic ether, 3-5 parts of diisobutyl ketone, 3-5 parts of butyl carbitol acetate, 3-5 parts of ethanol, 0.4-0.7 parts of linseed oil, 3-6 parts of carbon nanotubes, 0.2-0.5 parts of grape seed oil, and 0.3-0.6 parts of dimethyl silicone oil. As carbon nanotubes are added, the electrical conductivity, dispersity and circuit bonding strength are increased, the silver paste is not easy to fracture or fall off, and the consumption of silver powder is reduced. Through the use of glass powder, the melting point is low, sinter-molding is easy, and the electrical conductivity is not affected. Moreover, the silver paste has good printing performance, and the circuit is clear and continuous and has no bubbles.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, in particular to a silver paste for a PCB circuit board containing carbon nanotubes and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass powder, oxide p...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance