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Organosilicon high-molecular material and preparation method thereof

A silicon polymer and organosilicon technology, applied in the field of organosilicon synthesis, can solve problems such as poor compatibility, intolerance to hydrolysis, and separation of microstructures, and achieve the effect of good elasticity and controllable hardness

Active Publication Date: 2015-08-12
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

All organic-inorganic hybrid materials prepared by these methods cannot be used as an independent material.
[0004] Chinese patent document CN103145937A added hydroxyl-terminated polysiloxane to the synthesis of phenolic resin to obtain a toughened modified phenolic resin with siloxane segments in the resin molecule, but this type of material forms Si-O-C chemical bonds. On the one hand, it is not resistant to hydrolysis, and on the other hand, the hydroxyl group in the silicone segment has low reactivity, low degree of reaction, and uneven distribution
However, when the silicone polymer modified phenolic resin was used, it was found that due to the poor compatibility between the silicone component and the phenolic resin component, the microstructure was separated, and the material structure was difficult to control.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0055] Embodiment 1, the preparation of the modified polysiloxane that side chain contains phenol group

[0056] In a use N 2 In the replaced container, add 32.1g of 2-allylphenyl trimethylsilyl ether, 11.5g of methyldichlorosilane, 40mL of toluene as solvent, 0.1g of Karstedt catalyst containing Pt complex, and react at 80°C Until the Si-H bond completely disappears, the solvent toluene is removed to obtain the hydrosilylation product γ-phenyltrimethylsilyl ether methyl dichlorosilane. React 53.5 g of the hydrosilylation products γ-phenyltrimethylsilyl ether methyl dichlorosilane and 33.33 g of methylphenyldialkoxysilane in sufficient water, and adjust the pH to 3 with hydrochloric acid before the reaction. After liquid separation to remove small molecules, add 2.7 g of hexamethyldisiloxane and 0.26 g of trifluoromethanesulfonic acid, react for 3 hours, remove small molecules after neutralizing the catalyst, and obtain a modified compound with a phenol group-containing chain...

Embodiment 2

[0057] Embodiment 2, the preparation of the modified polysiloxane that side chain contains phenol group

[0058] In a use N 2 In the replaced container, add 32.1g of 2-allylphenyl trimethylsilyl ether, 17.7g of phenyldichlorosilane, 40mL of toluene as solvent, 0.1g of Karstedt catalyst containing Pt complex, and react at 80°C Until the Si-H bond completely disappears, the solvent toluene is removed to obtain the hydrosilylation product γ-phenyltrimethylsilyl ether phenyldichlorosilane. React 63.5 g of the hydrosilylation products γ-phenyltrimethylsilyl ether phenyldichlorosilane and 33.33 g of methylphenyldialkoxysilane in sufficient water, and adjust the pH to 3 with hydrochloric acid before the reaction. Add 2.7 g of hexamethyldisiloxane and 0.26 g of trifluoromethanesulfonic acid after liquid separation to remove small molecules, react for 3 hours, remove small molecules after neutralizing the catalyst, and obtain a modified compound with a phenol group-containing chain se...

Embodiment 3

[0059] Embodiment 3, the preparation of the modified polysiloxane that side chain contains phenol group

[0060] As in Example 1, 21.4 g of the hydrosilylation product γ-phenyltrimethylsilyl ether methyl dichlorosilane and 48.53 g of methylphenyldialkoxysilane were reacted in a sufficient amount of water, and hydrochloric acid was used before the reaction. Adjust pH=3. After liquid separation to remove small molecules, add 2.7 g of hexamethyldisiloxane and 0.26 g of trifluoromethanesulfonic acid, react for 3 hours, remove small molecules after neutralizing the catalyst, and obtain a modified compound with a phenol group-containing chain segment ratio of 20%. polysiloxane.

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Abstract

The invention relates to an organosilicon high-molecular material in a phenolic resin structure and a preparation method thereof. The organosilicon high-molecular material is prepared by carrying out crosslinking reaction on polysiloxane, of which the side chain is modified by a phenolic group, under the catalytic action of an alkali by using aldehydes or derivatives thereof as a crosslinking agent. The organosilicon high-molecular material polymer uses Si-O-Si as the main chain of the molecule, the side chain contains the phenolic group, and the aldehydes or derivatives thereof are used for crosslinking to form the phenolic-resin-like crosslinking point, thereby enhancing the high temperature resistance. The organosilicon high-molecular material can be stored for a long time, can not easily absorb water, and has stable physicochemical properties. The invention also relates to a preparation method of the organosilicon high-molecular material.

Description

technical field [0001] The invention belongs to the field of organosilicon synthesis, and in particular relates to an organosilicon polymer material with a phenolic resin structure and a preparation method thereof, which uses aldehyde or its derivatives as a crosslinking agent. Background technique [0002] Silicone polymers are polymers that contain elemental silicon in their molecular structure, and at least one organic group is directly connected to a silicon atom. Among them, polysiloxane with a silicon-oxygen bond (-Si-0-Si-) as the skeleton Alkanes are the main representatives. Due to the unique structure of silicone, which combines the properties of inorganic materials and organic materials, it has excellent characteristics such as low surface tension, high and low temperature resistance, electrical insulation, oxidation resistance stability, weather resistance, flame retardancy, corrosion resistance and physiological inertness. It is widely used in aerospace, electr...

Claims

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Application Information

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IPC IPC(8): C08G77/38C08G77/06C08G77/10
Inventor 周传健刘成林张晨赵士贵冯圣玉
Owner SHANDONG UNIV
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