Cob packaging process for integrated LED far and near light used in automobile headlights

A technology of automobile headlights and packaging technology, which is applied in the field of auto parts, can solve the problems of increasing the heat dissipation resistance of LED chips and unfavorable applications, and achieve the effects of being conducive to overall heat dissipation, compressing physical space and price costs, and improving heat dissipation channels

Inactive Publication Date: 2017-05-17
EAST CHINA NORMAL UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Automobile headlights work in a high-temperature, relatively airtight and narrow environment. The problem of heat dissipation is one of the core issues that determine its performance. Since the two modes require different types of brackets, the resistance to heat dissipation of the LED chip is increased. , which is not conducive to its application in automotive headlights

Method used

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  • Cob packaging process for integrated LED far and near light used in automobile headlights
  • Cob packaging process for integrated LED far and near light used in automobile headlights
  • Cob packaging process for integrated LED far and near light used in automobile headlights

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Such as Figure 5 As shown, the far and near light integrated LED light source module uses an aluminum nitride substrate with a thickness of 1.0mm. The front of the substrate is a copper foil layer with circuit functions. Strong bonding force and sufficient heat dissipation channels; the back of the substrate is a sheet of honeycomb copper foil layer, and the front and back copper foils of the substrate have gold-plated layers.

[0052] The number of LED chips for low beam and high beam in this light source are 4 and 7 respectively. The LED chip adopts a high-power chip with a vertical electrode structure. The negative electrode of the LED chip is fixed on a specific position in the front circuit of the aluminum nitride substrate by eutectic welding technology. The positive electrode of the LED chip is connected to the front of the substrate through a gold wire through a wire bonding process. In the circuit, realize the serial and parallel combined connection of LED ch...

Embodiment 2

[0056] Such as Figure 6 to Figure 8 As shown, the far and near light integrated LED light source module uses an alumina substrate with a thickness of 0.8mm. The front of the substrate is a copper foil layer with circuit functions. The copper foil layer is combined with aluminum nitride through high-temperature sintering, which has a good combination. The back of the substrate is a sheet of honeycomb copper foil layer, the front and back copper foils of the substrate have a gold-plated layer, and the copper foil on the front and back of the substrate is formed by the process of microporous copper paste and sintering. The path of morality.

[0057] The number of LED chips for low beam and high beam in this light source are 5 and 9 respectively. The LED chip adopts a high-power chip with a planar electrode structure. The back of the chip is gold-plated and can be fixed at a specific position in the front circuit of the alumina substrate through the eutectic welding process. The...

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Abstract

The invention relates to the technical field of automotive parts, in particular to a COB packaging process for integrating LED distance light and dipped light of an automotive headlamp. The process includes 1, adopting the high temperature melting method to sinter or plate copper paste or copper fossil layer to the front and back surfaces of a substrate; 2, welding LED chips to the copper fossil layer of the front surface of the substrate in an eutectic welding manner; 3, connecting the LED chips to the copper fossil layer of the front surface of the substrate through a metal film layer by the wire bonding process; 4, partitioning LED chip groups through surrounding glue by the die method or dispensing method; 5, coating the surfaces of the partitioned LED chips with phosphor powder film layer directly by the form plate spraying method or micro dispensing process; 6, coating transparent silicon or silicon with phosphor powder on the LED chips coated with phosphor powder. Compared with the prior art, the process has the advantages that non-transparent reflective surrounding glue is combined with vertical chips, the size and position of the light source emitting surface are guaranteed, and the light emitting evenness is controlled.

Description

technical field [0001] The invention relates to the technical field of auto parts, in particular to a COB encapsulation process for integrating LED far and near beams of an automobile headlamp. Background technique [0002] Automotive LEDs have been widely used in backlighting, car interior decoration, taillights, brake lights, turn signals and other small lights, meeting the multiple needs of consumers' individual pursuit, market selling points of automobile manufacturers, government promotion of energy conservation, and environmental protection economy. The market size of LED car lights has grown rapidly from US$690 million in 2007 to US$1.2 billion in 2011, with an average annual growth rate of 13% and a market penetration rate of 8%. At present, high-mounted brake lights, tail lights and turn signals are very popular. However, although it has been reported in 2009 that my country's full-LED automotive headlights have been successfully developed for LED car headlights, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/56H01L33/62H01L33/64
CPCF21K9/90F21Y2105/12
Inventor 张哲娟孙卓
Owner EAST CHINA NORMAL UNIV
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