Temperature-controllable double-gas channel spraying plate with uniform gas spraying function

Abstract

The invention discloses a temperature-controllable double-gas channel spraying plate with a uniform gas spraying function and mainly solves the problems of low heat transfer efficiency, large size of a spraying part and the like caused by non-reasonable structure in the prior art. The temperature-controllable double-gas channel spraying plate with the uniform gas spraying function is structurally characterized in that two gas channels and a snake-like liquid heat transfer medium channel are arranged inside the spraying plate; the two gas channels are isolated from each other; the snake-like liquid heat transfer medium channel is high in heat transfer efficiency. The two isolated gas channels and the snake-like liquid heat transfer medium channel are formed by combining an upper spraying plate, a diffusion baffle, a gas inlet ring, a closed ring and a spraying pore plate included by the part. A convective heat transfer position is arranged on one side of small spraying holes in a form of welding two parts to form a liquid-state heat transfer medium channel, so that the heat transfer efficiency is maximized, process requirements on simultaneous charging of two gases into cavities or switching of the cavities for reaction under controllable temperature conditions are met, the size of a spraying part is reduced, the heat transfer efficiency is improved, and the reliability of the spraying part is guaranteed.

Description

technical field [0001] The invention relates to a spraying part used in semiconductor equipment, in particular to a temperature-controlling double gas channel uniform gas spraying spray plate, which belongs to the technical field of semiconductor thin film deposition application and manufacture. Background technique [0002] In the existing semiconductor thin film deposition equipment, during the process, two or more gases often need to be fed into the chamber simultaneously or switched to react in a specific temperature field. And in most cases, this specific temperature field will directly affect the spray part in the form of heat radiation, causing the spray part to reach or approach its melting point, deformation and failure. At this time, the temperature control function of the spray part is transformed into Cooling of the main body of the shower part. In order to meet the current process requirements that two or more gases are simultaneously fed into the cavity or swi...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the above-mentioned problems, and mainly solve the problem that the side of the small spray hole in the structure of the existing spray parts, that is, the side closest to the heat source and the channel of the liquid heat transfer medium cannot be effectively approached due to space constraints, resulting in heat transfer efficiency. Low, large volume of spray parts, and it is not suitable to bury liquid heat transfer medium pipelines of other materials in the spray parts

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