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High-temperature-resistant adhesive tape and high-temperature-resistant adhesive used by high-temperature-resistant adhesive tape

A technology of high temperature resistance and adhesives, which is applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc. It can solve the problems of general heat resistance, reduced tape peel strength, and poor heat and oxygen aging resistance. To achieve good shock resistance, improve the ability to change the micro-conformation freely, and improve the effect of cohesion

Active Publication Date: 2015-07-22
苏州市新广益电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there are many problems in the substrates and adhesives selected for high temperature resistant tapes, such as: the substrates are mostly single-layer traditional materials, such as fabrics, foams, plastic films and non-woven fabrics with general heat resistance and moisture resistance; Adhesives mostly use acrylate or modified acrylic adhesives. Although these adhesives have excellent bonding performance, chemical stability, non-toxicity, and low cost, they have general heat resistance and are used in relatively At high temperature, the heat and oxygen aging resistance is poor, and as the temperature rises to 70°C, the peel strength of the tape will gradually decrease

Method used

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  • High-temperature-resistant adhesive tape and high-temperature-resistant adhesive used by high-temperature-resistant adhesive tape

Examples

Experimental program
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Effect test

Embodiment 1

[0041] Embodiment 1: a high temperature resistant adhesive tape and the high temperature resistant adhesive used therefor;

[0042] A high-temperature-resistant adhesive, the raw material formula of the high-temperature-resistant adhesive includes the following materials by weight:

[0043] 35 parts of silicone resin;

[0044] 25 parts of methyl vinyl silicone rubber;

[0045] 5 parts of benzoyl peroxide;

[0046] 15 parts of hydrogenated styrene-isoprene-styrene block copolymer;

[0047] 20 parts of polybutylene terephthalate;

[0048] Add silicone resin, methyl vinyl silicone rubber, hydrogenated styrene-isoprene-styrene block copolymer, and polybutylene terephthalate into a beaker filled with toluene according to the proportion, and heat to Dissolve at 70°C, add benzoyl peroxide dropwise, and continue to heat up to 90°C-120°C for polycondensation reaction for 1 hour to obtain the desired product, which is a light yellow transparent liquid.

[0049] The raw material formu...

Embodiment 2

[0052] Embodiment 2: a high temperature resistant adhesive tape and the high temperature resistant adhesive used therefor;

[0053] A high-temperature-resistant adhesive, the raw material formula of the high-temperature-resistant adhesive includes the following materials by weight:

[0054] 45 parts of silicone resin;

[0055] 25 parts of methyl vinyl silicone rubber;

[0056] 4 parts of benzoyl peroxide;

[0057] 16 parts of hydrogenated styrene-isoprene-styrene block copolymer;

[0058] 10 parts of polybutylene terephthalate;

[0059] Add silicone resin, methyl vinyl silicone rubber, hydrogenated styrene-isoprene-styrene block copolymer, and polybutylene terephthalate into a beaker filled with toluene according to the proportion, and heat to Dissolve at 70°C, add benzoyl peroxide dropwise, and continue to heat up to 90°C-120°C for polycondensation reaction for 1 hour to obtain the desired product, which is a light yellow transparent liquid.

[0060] The raw material for...

Embodiment 3

[0063] Embodiment 3: A high temperature resistant adhesive tape and the high temperature resistant adhesive used therefor;

[0064] A high-temperature-resistant adhesive, the raw material formula of the high-temperature-resistant adhesive includes the following materials by weight:

[0065] 25 parts of silicone resin;

[0066] 40 parts of methyl vinyl silicone rubber;

[0067] 3 parts of benzoyl peroxide;

[0068] 17 parts of hydrogenated styrene-isoprene-styrene block copolymer;

[0069] 15 parts of polybutylene terephthalate;

[0070] Add silicone resin, methyl vinyl silicone rubber, hydrogenated styrene-isoprene-styrene block copolymer, and polybutylene terephthalate into a beaker filled with toluene according to the proportion, and heat to Dissolve at 70°C, add benzoyl peroxide dropwise, and continue to heat up to 90°C-120°C for polycondensation reaction for 1 hour to obtain the desired product, which is a light yellow transparent liquid.

[0071] The raw material for...

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Abstract

The invention relates to a high-temperature-resistant adhesive tape and a high-temperature-resistant adhesive used by the high-temperature-resistant adhesive tape. The high-temperature-resistant adhesive tape comprises a polyimide film layer, a methyl vinyl phenyl polysiloxane rubber layer and a high-temperature-resistant adhesive layer which are sequentially stacked. A raw material formula of the high-temperature-resistant adhesive comprises the following components: 20-50 parts of organosilicon rubber resin, 15-40 parts of methyl vinyl silicone rubber, 2-8 parts of organic peroxides, 5-20 parts of a hydrogenated styrene-isoprene-styrene segmented copolymer and 2-20 parts of polybutylene terephthalate. The high-temperature-resistant adhesive tape prepared by the invention still has good peel strength and retentivity even if being exposed to a high-temperature condition.

Description

technical field [0001] The invention relates to a high-temperature-resistant adhesive tape and a high-temperature-resistant adhesive used therein, belonging to the technical field of adhesive tapes. Background technique [0002] With the rapid development of the economy and the improvement of people's material living standards, adhesive tape has been fully integrated into construction, industrial products, industrial production, assembly and people's daily life. Generally, construction, industry and other fields need to apply adhesive tapes outdoors, so the performance requirements for such adhesive tapes are also correspondingly increased, especially there are great expectations for their heat resistance. Generally, the temperature resistance of high temperature resistant tape is usually between 120 degrees and 260 degrees, and it is often used for coating masking and electronic industrial equipment, fixing parts in the manufacturing process, printed circuit boards and high...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J153/02C09J167/02C09J11/06C09J11/04C08G77/20C09J7/02
CPCC09J183/04C08G77/20C08K5/14C08L53/02C08L67/00C08L83/00
Inventor 夏超华
Owner 苏州市新广益电子股份有限公司
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