Method for manufacturing uniform-heating plate with foam copper as liquid absorption core

Abstract

The invention discloses a method for manufacturing a uniform-heating plate with foam copper as a liquid absorption core. The foam copper which is manufactured in a grading manner and has the different thicknesses and the porosity is sintered on an upper cover plate and a lower bottom plate manufactured through copper plates or copper foil of the corresponding different thicknesses, and through welding, vacuumizing, liquid injecting and packaging, the uniform-heating plate is manufactured. A cylindrical foam copper supporting column which is manufactured in a grading manner and has a certain thickness(generally larger than or equal to 0.8mm) is adopted by a middle steam cavity, rapid flowing of gas-liquid phase media is ensured, and medium phase change circulation speed is increased; and the foam copper which is manufactured in a grading manner is provided with a good capillary structure, and is uniform in pore structure distributing and high in porosity. The uniform-heating plate with foam copper as the liquid absorption core has the advantages of being high in heat dissipation efficiency, small in weight, suitable for manufacturing an ultra-thin structure, and capable of meeting the requirement of semiconductor electronic equipment with the high heat flow density for high heat conduction efficiency and miniaturization. The uniform-heating plate is low in manufacturing cost, high in manufacturing precision and suitable for purposes of heat radiation of a computer chip, cooling of high-energy electronic chips or photoelectric chips or radio frequency chips of the wireless or wire communication industry and the like.

Description

technical field [0001] The invention relates to a two-dimensional (planar) structure rapid heat dissipation device in semiconductor and electronic equipment, that is, a soaking plate and its manufacturing method, especially a soaking plate using foamed copper with a high-porosity graded structure as a liquid-absorbing core. Hot plate and its preparation method. Background technique [0002] With the rapid development of semiconductor and electronic technology, higher requirements are put forward for the heat dissipation of chips. The traditional heat dissipation method is to use fans to force convection to cool metal radiators. This method is far from meeting the high heat flux density of current chips. and miniaturization requirements of electronic equipment. The application of heat pipe technology solves the problem of using one-dimensional structural features to quickly export high heat flux and dissipate heat. The working principle of the vapor chamber is similar to th...

AI Technical Summary

Problems solved by technology

The former copper powder sintered structure is difficult to control the sintering effect, especially the overall uniformity and flatness due to the preparation of a large planar structure; while the latter woven copper mesh structure is due to its diffusion bonding with the copper plate, and the similar aperture results in poor capillary suction effect, so The combination effect and heat dissipation power need to be further improved

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