Film forming device and method
A technology of film forming device and target position, which is applied in the direction of vacuum evaporation plating, coating, electric solid devices, etc., can solve the problem of uneven film thickness, material injection pressure, difficult control of film thickness and speed, organic material physics Changes in chemical properties and other issues to achieve the effect of increasing speed
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[0026] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.
[0027] The present invention firstly provides a film forming device, which is used to form an organic material thin film at the target position of the substrate, with a structure such as figure 1 As shown, the device includes a gas delivery mechanism 101 and a gas injection mechanism 102, wherein:
[0028] Gas delivery mechanism 101: used to deliver the mixed gas of organic material vapor and inert gas to the gas injection mechanism 102;
[0029] Gas injection mechanism 102: used to inject the mixed gas delivered by the gas delivery mechanism to the target position on the substrate.
[0030] It can be seen from the above that the film forming device provided by the present invention sprays the mixed gas of organic material gas and inert gas to the targe...
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