A film forming device and method
A film-forming device and target position technology, applied in vacuum evaporation plating, coating, electro-solid devices, etc., can solve the problem of non-uniform film thickness, material injection pressure, film thickness and speed are not easy to control, organic material physical Changes in chemical properties, etc., to achieve the effect of increasing the speed
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[0026] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.
[0027] The present invention firstly provides a film forming device, which is used to form an organic material thin film at the target position of the substrate, with a structure such as figure 1 As shown, the device includes a gas delivery mechanism 101 and a gas injection mechanism 102, wherein:
[0028] Gas delivery mechanism 101: used to deliver the mixed gas of organic material vapor and inert gas to the gas injection mechanism 102;
[0029] Gas injection mechanism 102: used to inject the mixed gas delivered by the gas delivery mechanism to the target position on the substrate.
[0030] It can be seen from the above that the film forming device provided by the present invention sprays the mixed gas of organic material gas and inert gas to the targe...
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