A kind of multi-layer printed circuit board and its manufacturing method

Abstract

The invention discloses a multilayer printed circuit board and a manufacturing method thereof. The multilayer printed circuit board comprises at least one explosion-proof groove which is arranged in a line pattern area contacted with a dielectric layer, and the explosion-proof groove penetrates through the line pattern area contacted with the dielectric layer, an internal layer core board and a copper foil; or at least one explosion-proof groove is commonly arranged between the dielectric layer and the line pattern area contacted with the dielectric layer, and the explosion-proof groove penetrates through the dielectric layer, the line pattern area contacted with the dielectric layer, the internal layer core board and the copper foil; or the dielectric layer is provided with at least one explosion-proof groove which penetrates through the dielectric layer, the internal layer core board and the copper foil. Water vapor in the dielectric layer formed after curing of a prepreg in a hot melting area or the contacted solution in the subsequent technological process can be volatilized via the explosion-proof groove so that a phenomenon of board detonation near the hot melting area in high temperature baking of the multilayer printed circuit board can be reduced, and board detonation rate in the manufacturing process is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, in particular to a multilayer printed circuit board and a manufacturing method thereof. Background technique [0002] At present, the production process of PCB is as follows: schematic design>inner layer circuit making>oxidation treatment>pressing>punching>drilling holes>outer layer circuit making>line plating>outer layer etching>solder mask treatment>pad surface treatment >Shape processing>Electrical testing>Central inspection>Packaging. [0003] In the production process of multi-layer printed circuit boards, during the lamination process, since at least two layers of circuit boards need to be laminated, in order to prevent misalignment between layers during the lamination process, it is first necessary to place the inner layers of each layer The core board is positioned. The current positioning method includes nailing the inner core bo...

AI Technical Summary

Problems solved by technology

When high-temperature baking is required in the subsequent production process of circuit board production, the water vapor in the dielectric layer in the hot-melt area cannot be effectively discharged, and it is easy to appear explosive delamination in the hot-melt area, and the delamination will spread and extend to The entire multilayer printed circuit board, resulting in the scrapping of the multilayer printed circuit board

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