Manufacturing method of rigid-flexible printed circuit board with multi-step buried blind holes

Abstract

The invention discloses a manufacturing method of a rigid-flex printed circuit board with multi-step buried blind holes. The manufacturing method comprises the steps of manufacturing of an inner-layercopper flexible board, manufacturing of a middle-layer copper flexible board and manufacturing of an outer-layer copper flexible board. The manufacturing method of the inner-layer copper soft board comprises the steps of preprocessing, copper deposition, copper plating, post-processing, CVL pasting, pressing, baking and lamination waiting. The manufacturing method of the middle-layer copper softboard comprises the following steps: preprocessing, laminating with an inner-layer copper soft board to be laminated, laminating, punching, milling blind holes, removing glue slag, depositing copper,plating copper, post-processing, roughening and laminating. The manufacturing method of the outer-layer copper soft board comprises the steps of preprocessing, lamination with a middle-layer copper soft board to be laminated, lamination, punching, blind hole milling, glue residue removal, hole metallization, copper plating and post-processing. The multiple layers of copper soft boards in the rigid-flexible combined board are divided into three groups according to the inner part, the middle part and the outer part, and the rigid-flexible combined board with the multi-step buried blind holes ismanufactured through processing and laminating respectively. The processing efficiency is high, and the plate explosion rate and the layering rate of the laminated final product are low.

Description

technical field [0001] The invention relates to a method for manufacturing a rigid-flex board with multi-level buried blind holes. Background technique [0002] With the development of electronic products in the direction of high integration and multi-functionality, the surface area of ​​traditional rigid-flex boards can no longer meet the needs of component mounting. Electronic components need to be transferred from the surface of the circuit board to the inside, and thin-film resistors or capacitors are used to replace traditional discrete resistors or capacitors, which will greatly save the surface mount requirements of rigid-flex boards. [0003] Rigid-flex boards with multi-level buried blind holes have a larger operating space and can meet higher integration requirements, but the processing difficulty of rigid-flex boards with multi-level buried blind holes is much higher than that of ordinary rigid-flex boards , and the probability of explosion and delamination is al...

AI Technical Summary

Problems solved by technology

[0003] Rigid-flex boards with multi-level buried blind holes have a larger operating space and can meet higher integration requirements, but the processing difficulty of rigid-flex boards with multi-level buried blind holes is much higher than that of ordinary rigid-flex boards , and the probability of explosion and delamination is higher

In the actual use of the product, if the internal rigid-flex board explodes or delaminates, it will greatly affect the normal function of the product and the customer's experience

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