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Photosensitive Resin Composition Of Excellent Reliability And Method For Manufacturing Same

A resin composition and a technology for the composition are applied in the directions of optomechanical equipment, photoengraving process of pattern surface, photosensitive material for optomechanical equipment, etc. Different problems, lower production efficiency, etc., to achieve the effect of improving quality stability, shortening preparation time, and increasing output

Inactive Publication Date: 2015-03-18
KCC CORP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The conventional photosensitive resin composition uses a Roll Mill to disperse the inorganic filler in the raw materials, and the physical properties and degree of dispersion applied during the dispersion process vary depending on the resin composition. Thus, the photosensitive resin composition The characteristics of the product will also be different, so it will bring difficulties in quality management and process management
[0006] As described above, when a photosensitive resin composition is prepared using a roller mill according to the conventional technique, a long preparation time is required and the yield is reduced, thereby causing a problem of a reduction in production efficiency
In addition, the rolling mill has the disadvantages of high possibility of contamination due to exposure of the product to the outside during the dispersion process, and high risk of operational safety accidents

Method used

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  • Photosensitive Resin Composition Of Excellent Reliability And Method For Manufacturing Same
  • Photosensitive Resin Composition Of Excellent Reliability And Method For Manufacturing Same
  • Photosensitive Resin Composition Of Excellent Reliability And Method For Manufacturing Same

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specific example

[0092] The photocurable thermosetting resin composition of the present invention can also be obtained by coating the composition on a film such as polyethylene terephthalate and drying it in addition to the method of directly applying it to a substrate in a liquid state. Available in dry film form with solder resist layer. The concrete example that photocurable thermosetting resin composition of the present invention is used as dry film is as follows:

[0093] The dry film is a structure in which a base film, a solder resist layer, and a peelable protective film used as needed are laminated in sequence. The solder resist layer is a layer obtained by applying and drying a photocurable thermosetting resin composition capable of being developed with an alkaline aqueous solution on a base film or a protective film. A dry film can be obtained by forming a solder resist layer on a base film and then laminating a protective film, or forming a solder resist layer on a protective film...

Embodiment 1

[0106] Put 400g of high heat-resistant resin (SR90-B3T4, solid content = 65%, acid value = 57mgKOH / g, KCC) containing unsaturated double bonds and carboxyl groups into a reactor with a stirring device, bisphenol A type thermosetting 100 g of the active ingredient (YD-012, bisphenol A epoxy resin, softening point=80° C., equivalent weight=650, Kokudo Chemical) was stirred at 500 rpm for 10 minutes. After stirring, 10 g of the reactive diluent dipentaerythritol hexaacrylate (DPHA) (Nippon Kayaku) and 30 g of the photopolymerization initiator (Irgacure 369, oxime ester photopolymerization initiator, BASF) containing unsaturated double bonds were added, and then the Yellow coloring agent (pigment yellow 147, BASF) 2g, blue coloring agent (pigment blue 16:00, BASF) 6g and ion adsorbent (IXEPLAS, the mixture of hydrotalcite and zirconium phosphate, Dong Ya synthetic) 5g, stir 10 with 500rpm minute. After the stirring is completed, drop in 100 g of core-shell particle type elastomer...

Embodiment 2

[0108] Prepare a photocurable thermosetting resin composition in the same manner as in Example 1, except that a core-shell particle-type elastomer (MX-170, core: silicone resin, core content: 25%, dispersion medium : bisphenol A epoxy resin, KANEKA) 50g. The prepared photocurable thermosetting resin composition had a solid content of 73% and a viscosity of 12500 mPa.s.

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Abstract

The present invention relates to a photosensitive resin composition of an excellent reliability and a method for manufacturing the same, in particular to a photocuring and thermocuring resin composition which can guarantee the important characteristics, such as the PCT resistance, the HAST resistance, the non-electrolytic gold plating resistance, the thermal shock resistance, etc., of a semiconductor package solder resist, and also can form a cured film having the excellent flexibility, a method for manufacturing the same, a dry film, a cured material, and a printed circuit board formed by the cured film forming the solder resist and the like.

Description

technical field [0001] The present invention relates to a photosensitive resin composition excellent in reliability and a method for producing the same, and more particularly to a solder resist capable of securing important properties such as PCT resistance, HAST resistance, electroless gold plating resistance, and thermal shock resistance. , a photocurable thermosetting resin composition capable of forming a cured film excellent in flexibility, a preparation method thereof, a dry film and a cured product thereof, and a printed wiring board formed by forming a cured film such as a solder resist. Background technique [0002] Solder resists for semiconductor packaging substrates currently used are required to have high resolution, high imaging performance, and high reliability. In particular, in order to ensure high reliability, resistance to high temperature and high humidity conditions is required, for example, in the evaluation of pressure cooker test (PCT, Pressure Cooker...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004
CPCG03F7/004G03F7/0045G03F7/11H05K3/00H05K3/0002
Inventor 孔炳善金喆镐段澈湖权甫宣李珉成郑贤真
Owner KCC CORP CO LTD
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