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Copper-clad plate with aluminum substrate and media filled with ceramics and method for manufacturing copper-clad plate

A technology of filling medium and manufacturing method, which is applied in the direction of printed circuit manufacturing, chemical instruments and methods, circuit substrate materials, etc., can solve the problems of reducing mechanical drilling and cutting processability and heat resistance of LED aluminum-based circuit boards, and achieve improved toughness and adhesion, high pressure resistance, high heat dissipation effect

Active Publication Date: 2015-02-18
嘉兴庆春电子科技有限公司
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  • Abstract
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Problems solved by technology

In addition, the filling of ordinary ceramic powder will reduce the mechanical drilling and cutting processability and heat resistance of the LED aluminum-based circuit board

Method used

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  • Copper-clad plate with aluminum substrate and media filled with ceramics and method for manufacturing copper-clad plate
  • Copper-clad plate with aluminum substrate and media filled with ceramics and method for manufacturing copper-clad plate
  • Copper-clad plate with aluminum substrate and media filled with ceramics and method for manufacturing copper-clad plate

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Embodiment Construction

[0027] The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

[0028] see figure 1 The embodiment of the present invention provides a ceramic-filled dielectric aluminum substrate copper clad laminate 10, which includes an aluminum base plate 12, an insulating layer 14, and a conductive circuit layer 16, and the insulating layer 14 is stacked on the aluminum base plate 12 and the aluminum base plate 12. between the conductive circuit layers 16, wherein the insulating layer 14 comprises epoxy resin and α-Al dispersed in the epoxy resin 2 o 3 ceramic powder.

[0029] The aluminum base plate 12 is a low-alloyed Al-Mg-Si series high-plastic alloy plate, which has good thermal conductivity, electrical insulation performance and machinability. The model of the aluminum plate of the alumin...

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Abstract

The invention provides a copper-clad plate with an aluminum substrate and media filled with ceramics and a method for manufacturing the copper-clad plate. The copper-clad plate with the aluminum substrate and the media filled with the ceramics comprises an aluminum-base bottom plate, an insulating layer and a conducting circuit layer. The insulating layer is stacked between the aluminum-base bottom plate and the conducting circuit layer and comprises epoxy resin and alpha-Al<2>O<3> ceramic powder, the alpha-Al<2>O<3> ceramic powder is dispersed in the epoxy resin, and the mass percent of the alpha-Al<2>O<3> ceramic powder in the insulating layer ranges from 3% to 9%. The copper-clad plate and the method have the advantages that the insulating layer of the copper-clad plate with the aluminum substrate and the media filled with the ceramics comprises the alpha-Al<2>O<3> ceramic powder and the epoxy resin, alpha-Al<2>O<3> is high heat conductivity and voltage withstand property and is added into the insulating layer, and accordingly the problem of degradation of voltage withstand property due to ceramic powder filling can be effectively solved.

Description

technical field [0001] The invention relates to the technical field of LED circuit boards, in particular to a ceramic filling with a thermal conductivity of not less than 2.0W / (m·k), a withstand voltage of not less than 30kv / mm, and good mechanical drilling and cutting processability and heat resistance. A dielectric aluminum substrate copper clad laminate and a manufacturing method thereof. Background technique [0002] The aluminum-based circuit board is one of the key components of the LED lamp, which plays the role of circuit connection, support, and heat dissipation. With the increase in the number of LEDs installed on the aluminum-based circuit board and the power of a single LED, the aluminum-based circuit board The heat dissipation and voltage carried are also increasing. Therefore, high withstand voltage and high thermal conductivity requirements are put forward for LED aluminum-based circuit boards. For example, when the cumulative power of LEDs installed in outdo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/00B32B15/092B32B27/18B32B27/20B32B3/14B32B33/00
Inventor 金壬海
Owner 嘉兴庆春电子科技有限公司
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