ON CELL solid-state full lamination module processing method

Abstract

The invention discloses an ON CELL solid-state full lamination module processing method which comprises the following steps: bonding a DRIVER IC at an IC MASK of a TFT substrate under an ON CELL TFT liquid crystal display, then bonding a touch SENSOR FPC at a PIN outlet end of an ITO SENSOR circuit on a colored filter substrate of the ON CELL TFT liquid crystal display, bonding a TFT FPC on the TFT substrate under the ON CELL TFT liquid crystal display, pasting an upper polaroid and a lower polaroid, pasting solid-state OCA optical cement on the upper polaroid of the prepared ON CELL TFT liquid crystal display, performing full lamination on the upper polaroid and cover plate glass, and finally, assembling backlight with the full lamination upper polaroid and cover plate glass to form an ON CELL solid-state full lamination module. The processing method has the following advantages: the prepared ON CELL solid-state full lamination module has the advantages of simple processing flow, high assembling accuracy and processing yield.

Description

technical field [0001] The invention belongs to the technical field of ON CELL full lamination modules, and in particular relates to a processing method for ON CELL solid state full lamination modules. Background technique [0002] With the improvement of living standards, one of the development trends of color liquid crystal display modules is to develop towards the integration of touch display. At present, the integrated touch display module is divided into CTP (GF / GFF / OGS and other types of touch screen) and TFT to form a full paste Cladding module, and ON CELL, IN CELL and other touch display integrated TFT liquid crystal display plus cover plate (COVER GLASS) to form two forms of fully laminating module. [0003] Ordinary ON CELL touch display integrated module, the process is generally to paste the upper and lower polarizers first, then bond the COG IC, then bond the ITO SENSOR FPC, and finally bond the TFT FPC. The full lamination process is divided into solid state ...

AI Technical Summary

Problems solved by technology

The full lamination process is divided into solid state and liquid state lamination process. The solid state process is to take the ON CELL module, paste the solid OCA optical glue, and then fully bond with the upper cover. The ON made by this process method CELL full lamination module, there are situations where the polarizer on the ON CELL TFT LCD display is prone to burnt, the bonding area shows white, the process is not easy to control, and the yield rate is low. However, the ON CELL produced by using liquid OCA adhesive Lamination module needs to use special liquid full lamination machine, UV curing machine and other equipment, and it is prone to insufficient curing, too much manual wiping of liquid residual glue, and difficulty in controlling the thickness of full lamination.

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