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COB type LED packing piece based on beryllium oxide ceramic substrate and production method

A technology of LED package and beryllium oxide ceramics, which is applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., to achieve the effect of light weight, small size and good reliability

Active Publication Date: 2015-02-04
广东韶华科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the 1215 ceramic substrate can only realize the packaging of products below 10W, and cannot package LED products with higher power. If you want to realize the packaging of products above 10W, you must use larger-sized ceramic substrates, such as 1515, 2020, etc.

Method used

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  • COB type LED packing piece based on beryllium oxide ceramic substrate and production method
  • COB type LED packing piece based on beryllium oxide ceramic substrate and production method
  • COB type LED packing piece based on beryllium oxide ceramic substrate and production method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Put the beryllium oxide ceramic plate into the ceramic cleaning agent, heat it to boiling state and cook for 20 minutes, take it out and rinse it alternately with cold-hot-cold deionized water for 15 minutes each (the temperature of hot deionized water is 30°C), and then place it in acetone Ultrasonic cleaning in the solution for 10 minutes, after taking it out, rinse it alternately with cold-hot-cold deionized water for 15 minutes each (the temperature of hot deionized water is 30°C), and dry it under an infrared lamp to form a substrate; place the substrate on a 300-mesh nylon screen Under the plate, align the position between the substrate and the screen according to the electrode pattern to ensure that the distance between the substrate and the screen is 0.1mm, and use a 45° scraper to scrape the silver paste from the screen to the surface of the substrate to complete the electrode printing; Afterwards, bake the printed electrode substrate in a high-temperature sinte...

Embodiment 2

[0055] Put the beryllium oxide ceramic plate into the ceramic cleaning agent, heat it to boiling state and cook for 20 minutes, take it out and rinse it alternately with cold-hot-cold deionized water for 15 minutes each (the temperature of hot deionized water is 30°C), and then place it in acetone Ultrasonic cleaning in the solution for 10 minutes, after taking it out, rinse with cold-hot-cold deionized water alternately for 15 minutes each (hot deionized water temperature is 30°C), and dry to form a substrate; place the substrate under a 300-mesh nylon screen plate, Align the position between the substrate and the screen according to the electrode pattern, ensure that the distance between the substrate and the screen is 0.11mm, use a 45° scraper to scrape the silver paste from the screen to the surface of the substrate to complete the printing of the electrode; after that, place The printed electrode substrate is baked in a high-temperature sintering furnace at 955°C for 60 mi...

Embodiment 3

[0057]Put the beryllium oxide ceramic plate into the ceramic cleaning agent, heat it to boiling state and cook for 20 minutes, take it out and rinse it alternately with cold-hot-cold deionized water for 15 minutes each (the temperature of hot deionized water is 30°C), and then place it in acetone Ultrasonic cleaning in the solution for 10 minutes, after taking it out, rinse it alternately with cold-hot-cold deionized water for 15 minutes each (the temperature of hot deionized water is 30°C), and finally dry it under an infrared lamp to complete cleaning and form a substrate; place the substrate in Under the 300-mesh nylon screen, align the position between the substrate and the screen according to the electrode pattern, and ensure that the distance between the substrate and the screen is 0.99mm, use a 45° scraper to scrape the silver paste from the screen to the substrate The electrode is printed on the surface; after that, bake the substrate with the printed electrode in a hig...

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Abstract

The invention provides a COB type LED packing piece based on beryllium oxide ceramic substrate and production method, and the packing piece comprises a substrate made of the beryllium oxide ceramic board, a box dam and two symmetrical electrodes are formed on the substrate; a plurality of series circuits not crossed to each other and composed of light-emitting diode are formed in the substrate solid crystal region, two ends of each series circuit are respectively connected to two electrodes, the fluorescent powder glue is fixedly sealed in the box dam. The COB type LED packing piece based on beryllium oxide ceramic substrate is prepared by the steps as follows: cleaning beryllium oxide ceramic board, screen-printing the electrode, high temperature sintering, manufacturing the box dam, baking and dehumidifying, plasma cleaning, pasting LED chip, baking, bonding, baking, coating fluorescent powder glue in the box dam and solidifying, blanking, spectral testing, packaging and putting in storage. The beryllium oxide substrate is applied to the LED in the LED packing piece with good heat radiation capability, the high power LED packing product is small in volume, light in weight and high in reliability.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging for electronic device manufacturing, and relates to an LED package, in particular to a COB-type LED package based on a beryllium oxide ceramic substrate; the invention also relates to a production method of the package. Background technique [0002] At present, COB (Chip On Board) LED packages produced by general-purpose technology are most widely used in aluminum substrate, ceramic substrate and copper substrate packages, and the appearance specifications include 1215, 1515, 2020 and many other specifications. In COB LED packaging products, the heat dissipation performance of the product is closely related to its packaging materials, dimensions and product power, especially the selection of packaging substrates. For example, the 1215 ceramic substrate can only realize the packaging of products below 10W, and cannot package LED products with higher power. If you want to realize the...

Claims

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Application Information

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IPC IPC(8): H01L33/48
CPCH01L33/483H01L2933/0033H01L2224/48091H01L2224/48137H01L2924/00014
Inventor 连军红张弘慕蔚邵荣昌王江
Owner 广东韶华科技有限公司
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