Little-defect clean Sn-Zn solder containing palladium and preparing method thereof

Abstract

The invention discloses little-defect clean Sn-Zn solder containing palladium. The solder comprises metal components including, by weight, 0.05-0.3% of Pd, 0.1-0.5% of Ga, 6-10% of In, 0.1-3.5% of Ag, 7-10% of Zn and the balance Sn. During preparation, the palladium is ground into powder for use after hydrogen absorption, and silver and tin are smelted into silver-tin intermediate alloy in proportion; remaining tin and the molten silver-tin intermediate alloy are placed in a furnace for melting, raw material zinc is added after temperature of molten liquid rises to 350-450 DEG C, heat preservation is carried out, and Sn-Zn-Ag intermediate alloy liquid is obtained; raw material indium and gallium are sequentially added, when the temperature of the molten liquid lowers to 250-350 DEG C, heat preservation is carried out, and Sn-Zn-Ag-In-Ga intermediate alloy liquid is obtained; palladium powder is added and is covered with a mixture of zinc chloride and vegetable oil after complete melting, heat preservation is carried out, and the mixture is poured to form cast ingot; the solder can be obtained after the cast ingot is extruded and drawn or rolled into a wire shape or a flaky shape. The solder has the advantages of being high in cleanliness, high wettability, little in soldering seam defect, low in melting point and the like.

Description

technical field [0001] The invention relates to a brazing filler metal for zinc-aluminum alloy brazing, in particular to a palladium-containing poorly clean Sn-Zn brazing filler metal, and also relates to a preparation method of the brazing filler metal. Background technique [0002] Zinc alloys, especially wrought zinc alloys, have excellent comprehensive properties and become ideal substitutes for copper alloys in some fields, and have broad application prospects in cluster industries such as electronic communications, sanitary ware, hardware construction, electromechanical, and clothing. Many industries such as sanitary ware, hardware, home appliances and other light industries have used wrought zinc alloys to manufacture structural parts, so replacing copper structures with zinc-aluminum alloys is bound to become a development direction of the manufacturing industry. [0003] At present, low-temperature soft soldering is generally used for zinc alloy brazing at home and ...

AI Technical Summary

Problems solved by technology

"Sn-Zn-Ga-Ce lead-free solder" has been developed on the basis of Sn-Zn, such as Chinese invention patent: a kind of tin-zinc base lead-free solder alloy announced by publication number CN101585120, published by publication number CN101058131 A kind of Sn-Zn lead-free solder alloy of Sn-Zn system and its preparation method and the Sn-Zn solder of multiple " multi-element alloy system " such as tin-zinc base containing rare earth element lead-free solder alloy published by Publication No. CN1390672, they and Compared with the binary Sn-Zn alloy solder, some properties have been improved, but the overall performance is not as good as the traditional Sn-Pb solder. Therefore, the Sn-Zn solder still needs further improvement.