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In-line type multicavity laminated parallel processing vacuum equipment and use method thereof

A vacuum equipment, parallel processing technology, applied in coating, metal material coating process, gaseous chemical plating, etc., can solve the problems of manipulator not being too fast, increasing manipulator manufacturing cost, inaccurate substrate positioning, etc. The effect of improving equipment intensification, reducing the number of handling, increasing productivity and production efficiency

Inactive Publication Date: 2014-11-26
IDEAL ENERGY EQUIP (SHANGHAI) LTD
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AI Technical Summary

Problems solved by technology

[0007]However, in practice, this cluster-type stacked equipment structure is only suitable for thin film deposition processes with long process times (greater than 10 minutes), because : In PECVD equipment, the transfer of the substrate is realized by the manipulator. Since the fifth-generation substrate of the popular flat-panel display has the characteristics of large area and heavy weight, the handling speed of the manipulator should not be too fast, otherwise it will easily cause jitter , resulting in inaccurate positioning of the substrate and even debris during the handling process. At the same time, for the manipulator manufacturer, the faster the manipulator handling speed means the higher the performance requirements of the manipulator, which increases the manufacturing cost of the manipulator accordingly.

Method used

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  • In-line type multicavity laminated parallel processing vacuum equipment and use method thereof
  • In-line type multicavity laminated parallel processing vacuum equipment and use method thereof
  • In-line type multicavity laminated parallel processing vacuum equipment and use method thereof

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Embodiment Construction

[0045] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0046] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented by other methods different from those described here, so the present invention is not limited by the specific embodiments disclosed below.

[0047] As described in the background technology, in the cluster vacuum equipment commonly used in industrial production, since the manipulator is installed in the transmission chamber in the center of the cluster equipment, corresponding to each film forming process in the PECVD equipment, the transmission chamber The manipulator inside has to move 10 times. For some chemical vapor deposition processes with short film forming...

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Abstract

The invention relates to in-line type multicavity laminated parallel processing vacuum equipment, which includes: a sheet feed chamber, a reaction chamber and a sheet discharge chamber that are connected in order linearly. The equipment is characterized in that: a first transmission unit and a second transmission unit for substrate transmission are respectively disposed in the sheet feed chamber and the sheet discharge chamber. At least two sub-reaction chambers for preparation a needed film are vertically stacked inside the reaction chamber, and each of the sub-reaction chambers is provided with an open-close device respectively on a side facing the sheet feed chamber and on a side facing the sheet discharge chamber. The equipment can reduce the number of substrate carrying times, and improve the equipment productivity and production efficiency.

Description

[0001] Technical field: [0002] The invention relates to a vacuum film-forming equipment in the field of manufacturing solar cells and flat panel displays, in particular to a vacuum equipment for in-line multi-cavity lamination parallel processing and a use method thereof. [0003] [0004] Definition: The process time referred to in this article refers to the processing time of the substrate in the reaction chamber. technical background [0005] In the field of solar cell and flat panel display manufacturing, plasma-enhanced chemical vapor deposition (PECVD) technology is the most common silicon thin film deposition technology. It is a method of decomposing the incoming gas into highly active particles, so that a chemical reaction occurs on the surface of the substrate to deposit a thin film. PECVD technology can be used to prepare films such as amorphous silicon, microcrystalline silicon, silicon germanium, silicon nitride, silicon oxide, silicon oxynitride, etc. wide...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/54C23C16/44
Inventor 陈金元胡宏逵李一成谭晓华马哲国
Owner IDEAL ENERGY EQUIP (SHANGHAI) LTD
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