Conductive silver paste containing nickel powder of PCB and preparation method thereof

Abstract

Conductive silver paste containing nickel powder of a PCB is prepared by the following raw materials, by weight: 3-5 parts of 10nm-20nm nickel powder, 3-5 parts of 30nm-60nm cobalt powder, 1-2 parts of tartaric acid, 50-60 parts of micro-sized silver powder, 1-2 parts of Carbomer resin, 0.4-0.8 parts of sodium lauroyl sarcosine, 0.8-1.2 parts of citric acid, 10-13 parts of glass powder, 1-2 parts of Arabic gum, 7-9 parts of hyperbranched polyester, 9-13 parts of acetic acid n-butyl ester, 1-2 parts of 2-ethyl-4-methyl imidazole, 3-5 parts of isophorone and 2-4 parts of cyclohexanone. The micro-sized nickel powder and the cobalt powder are added into the silver paste, holes are filled with the micro-sized nickel powder, the cobalt powder and the micro-sized silver powder alternatively, and therefore, conductivity is strengthened. The glass powder has a low fusing point, conductivity is not affected, and firm bonding and friction resistance are achieved.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a conductive silver paste for a PCB circuit board containing nickel micropowder and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance