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Method for self-assembling and preparing high-density nanometer phase change structure

A nano-phase and structure-changing technology, applied in nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of long preparation cycle, low efficiency and long time

Inactive Publication Date: 2014-09-10
QUFU NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The preparation of the above-mentioned nanostructures not only requires multi-step complex processes, but also requires sophisticated and expensive nano-exposure equipment; in addition, the preparation cycle is long, and it takes a long time to prepare a high-density nanostructure unit. To prepare a complete high-density nanostructure Arrays of structures take longer and are less efficient

Method used

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  • Method for self-assembling and preparing high-density nanometer phase change structure
  • Method for self-assembling and preparing high-density nanometer phase change structure
  • Method for self-assembling and preparing high-density nanometer phase change structure

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Embodiment 1

[0016] After sputtering and growing the phase change material film on the Si wafer, a uniform and orderly array of PS nanosphere arrays were prepared on the surface of the phase change material film by injection method as an etching mask, and then the PS The phase-change material around the nanospheres is etched away, and finally the PS nanospheres are removed to prepare a high-density nanophase-change structure on the Si substrate. Such as figure 1 shown.

Embodiment 2

[0018] Thermal oxidation of SiO2 films and sputtering growth of phase change material films on the cleaned Si wafers in sequence, followed by injection on the surface of the phase change material films to form uniform and orderly arrays of PS nanospheres; then PS nanosphere arrays It is used as a mask, etched by plasma etching technology, and finally removed by polishing and plasma cleaning to prepare the high-density nano phase transition structure on the SiO2 substrate of the present invention. Such as figure 2 shown.

Embodiment 3

[0020] Prepare SiO2 dielectric material thin film by thermal oxidation on Si wafer, prepare W thin film on SiO2 dielectric material thin film, then sputter and grow phase change material thin film on W thin film, and then adopt dipping method to prepare uniform and orderly arrangement on the surface of W thin film The PS nanosphere array is used as an etching mask, etched by plasma etching technology, and finally the PS nanospheres are removed to prepare a high-density nanophase transition structure based on a conductive substrate. Such as image 3 shown.

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Abstract

Theories and experiments show that energy needed by reversible phase change can be reduced through reduction of a phase change region, and the purpose of reducing power consumption can be further realized. The traditional preparation of the high-density nanometer structure needs a complex technology with multiple steps and precise nanometer exposure, is long in preparation period and low in efficiency. The invention provides a method for self-assembling and preparing a high-density nanometer phase change structure. The method comprises the steps of: preparing a phase change material film on a medium or a conductive substrate such as a silicon wafer, a quartz sheet and the like, and preparing a uniformly and sequentially arranged nanosphere array by adopting a self-assembling method; adjusting intervals of the nanosphere array by utilizing a plasma or reactive ion etching technology; preparing a sequential, uniform and high-density nanometer phase change structure by regarding the nanosphere array as a mask and utilizing an etching technology. By utilizing the method disclosed by the invention to prepare the high-density nanometer phase change structure, the preparation cost is saved, the preparation efficiency is improved, the power consumption can be reduced, and the photoelectric performance of the device can be improved.

Description

technical field [0001] The invention relates to the relevant field of semiconductor devices, in particular to a method for preparing a high-density nanometer optical or electrical device. Background technique [0002] The amount of data and information in today's society is increasing rapidly, and the requirements for information storage are also increasing. The current mainstream storage technology in the market will be replaced by the next generation of high-performance new storage technology. Phase change memory technology has attracted more and more attention. Phase change memory technology originated from S.R.Ovshinsky's research on chalcogenide amorphous semiconductors. He reported the transition phenomenon between high and low resistance values ​​of chalcogenide materials under electric field excitation in the late 1960s and early 1970s. , put forward the idea that phase-change thin films can be applied to phase-change storage media (Phys. Rev. Lett., 21, 1450~1453,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/033B82Y30/00
CPCB82Y40/00H10N70/061
Inventor 韩培高钱波吴良才宋志棠张霞
Owner QUFU NORMAL UNIV
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