Method for self-assembling and preparing high-density nanometer phase change structure
A nano-phase and structure-changing technology, applied in nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of long preparation cycle, low efficiency and long time
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Embodiment 1
[0016] After sputtering and growing the phase change material film on the Si wafer, a uniform and orderly array of PS nanosphere arrays were prepared on the surface of the phase change material film by injection method as an etching mask, and then the PS The phase-change material around the nanospheres is etched away, and finally the PS nanospheres are removed to prepare a high-density nanophase-change structure on the Si substrate. Such as figure 1 shown.
Embodiment 2
[0018] Thermal oxidation of SiO2 films and sputtering growth of phase change material films on the cleaned Si wafers in sequence, followed by injection on the surface of the phase change material films to form uniform and orderly arrays of PS nanospheres; then PS nanosphere arrays It is used as a mask, etched by plasma etching technology, and finally removed by polishing and plasma cleaning to prepare the high-density nano phase transition structure on the SiO2 substrate of the present invention. Such as figure 2 shown.
Embodiment 3
[0020] Prepare SiO2 dielectric material thin film by thermal oxidation on Si wafer, prepare W thin film on SiO2 dielectric material thin film, then sputter and grow phase change material thin film on W thin film, and then adopt dipping method to prepare uniform and orderly arrangement on the surface of W thin film The PS nanosphere array is used as an etching mask, etched by plasma etching technology, and finally the PS nanospheres are removed to prepare a high-density nanophase transition structure based on a conductive substrate. Such as image 3 shown.
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