High-strength printed circuit board conductive silver paste and preparing method thereof

Abstract

High-strength printed circuit board conductive silver paste is composed of, by weight, 6-8 parts of nanoscale spherical silver powder, 6-8 parts of nanoscale sheet-shaped silver powder, 30-40 parts of micron-order spherical silver powder, 30-40 parts of micron-order sheet-shaped silver powder, 4-6 parts of ethylene glycol, 1-2 parts of ricinoleic acid, 0.5-1 part of ole-monoethanolamine, 8-10 parts of glass powder, 0.2-0.3 part of polyethylene wax, 4-7 parts of butyl alcohol, 4-6 parts of acetone, 3-5 parts of menthol, 0.3-0.6 part of triethanolamine, 5-8 parts of xylene and 4-6 parts of calcium sulfate whiskers. According to the high-strength printed circuit board conductive silver paste, the silver powder with different grain diameters and different shapes is matched so that the good conductivity can be achieved; the glass powder is used, so that the fusion point is low, the thermal expansivity is low, and the performance of a circuit is stable; the calcium sulfate whiskers are added, so that the strength of the circuit is high and the circuit is resistant to abrasion, not prone to breakage and durable.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a high-strength printed circuit board conductive silver paste and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass powder, ...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance