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Diamond wire squaring machine

A technology of diamond wire and square cutting machine, applied in the direction of fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of poor cutting and low cutting efficiency, achieve easy control, smooth cutting process, improve cutting accuracy and the effect of its efficiency

Active Publication Date: 2014-07-16
海宁市日进科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a diamond wire squarer to solve the problems of poor cutting and low cutting efficiency in the prior art

Method used

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  • Diamond wire squaring machine
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Embodiment Construction

[0039] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0040] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not intended to limit the present invention Therefore, it has no technical substantive meaning, and any modification of structure, change of proportional relationship ...

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PUM

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Abstract

The invention provides a diamond wire squaring machine which comprises a rack. The rack is provided with a rack platform, two workbenches, a supporting stand column, a turning-connection support and two wire stands, wherein the two workbenches and the supporting stand column are arranged on the rack platform, the turning-connection support is arranged on the supporting stand column in a lifting mode, and the two wire stands are connected to the two sides of the turning-connection support in a coupling and rotating mode. Each wire stand is provided with a cutting roller, a server motor and a diamond wire which is wound on the cutting roller. Any wire stand rotates relative to the turning-connection support in a coupling mode to drive the diamond wire to alternatively and obliquely cut machined parts on the workbenches relative to the horizontal line, the entire cutting process is smooth, control is easy, the cutting time is greatly shortened, and the cutting precision and the cutting efficiency are improved.

Description

technical field [0001] The invention relates to a multi-wire cutting technology, in particular to a diamond wire squarer. Background technique [0002] Multi-wire cutting technology is a relatively advanced crystalline silicon processing technology in the world at present. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub against hard and brittle materials such as semiconductors to achieve the cutting effect. Compared with traditional saw blades, grinding wheels and inner circle cutting, multi-wire cutting technology has the advantages of high efficiency, high productivity, and high precision. Multi-wire cutting technology is currently the most widely used cutting technology for hard and brittle materials such as semiconductors. [0003] Existing multi-wire cutting equipment such as crystalline silicon rod cutting machines usually at least include: a frame, a workbench arranged on the frame for carrying crysta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
Inventor 卢建伟
Owner 海宁市日进科技有限公司
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