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Thermosetting resin composition

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problem of improper proportion of bismaleimide resin, compatibility, and increase the difficulty of implementation, etc. question

Active Publication Date: 2014-07-02
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, phosphorus-containing epoxy resin is used in this scheme, and its inappropriate ratio with allyl-modified bismaleimide resin will cause compatibility problems, and may affect the heat resistance of the composite material (such as Tg, resistance Humid heat performance) has adverse effects, which increases the difficulty of implementing the scheme

Method used

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Examples

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Synthetic example 1

[0089] A kind of allyl modified bis-horse resin prepolymer is prepared by the following method:

[0090] Mix 4,4'-diphenylmethane bismaleimide resin and diallyl bisphenol A at a mass ratio of 100:30, and react at 110°C for 20 minutes to obtain allyl-modified bismaleimide resin The prepolymer is denoted as Shuangma 1.

Synthetic example 2

[0092] A kind of allyl modified bis-horse resin prepolymer is prepared by the following method:

[0093] Mix 4,4'-diphenylisopropyl bismaleimide resin and allyl phenoxy resin at a mass ratio of 100:120, and react at 160°C for 30 minutes to obtain allyl-modified bismaleimide The resin prepolymer is Shuangma 2.

Synthetic example 3

[0095] A kind of allyl modified bis-horse resin prepolymer is prepared by the following method:

[0096] Mix 4,4'-diphenylsulfone bismaleimide resin and diallyl diphenyl ether at a mass ratio of 100:15, and react at 120°C for 120 minutes to obtain allyl-modified bismaleimide resin The prepolymer is Shuangma 3.

[0097] Embodiments 1-11 provide 11 thermosetting resin compositions; Comparative Examples 1-7 provide 7 resin compositions for comparison with the resin compositions provided in Examples 1-11; said Examples 1-6 The formulations of the resin compositions provided are shown in Table 1; the formulations of the resin compositions provided in Examples 7-11 are shown in Table 2; the formulations of the resin compositions provided in Comparative Examples 1-7 are shown in Table 3.

[0098] The formula of the resin composition that table 1 embodiment 1~6 provides

[0099]

[0100]

[0101] The formula of the resin composition that table 2 embodiment 7~11 provides

[01...

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Abstract

The invention relates to a thermosetting resin composition which is composed of a combination and a solvent, wherein the combination comprises the following components in parts by weight: 20-100 parts of halogen-free epoxy resin, 10-30 parts of nitrile-base resin, 20-100 parts of allyl modified bismaleimide resin prepolymer, 20-100 parts of curing agent and 10-100 parts of filler; and the combination is dissolved in the solvent, and accounts for 65-75 wt% of the total composition. The UL-V0 green environment-friendly thermosetting resin composition has excellent toughness, machinability and water absorptivity.

Description

technical field [0001] The invention relates to a resin composition, in particular to a thermosetting resin composition and a prepreg made of it and a laminate for a printed circuit, which belong to the technical field of electronic materials and can be applied to integrated circuit packaging, high-frequency high-speed and high-speed Density interconnect. Background technique [0002] At present, driven by multi-functionality, high performance and light weight and thin profile, the electronics industry is developing rapidly. Taking IC packaging as an example, from the initial through-hole insertion (PTH Insertion) method, it gradually transitioned to the surface mount (SMT) method, and then evolved to BGA, CSP and Flip Chip as the main packaging forms. The rapid development of technology puts forward more stringent requirements for printed circuit boards and copper clad laminates. For example, related products are required to have a series of excellent comprehensive proper...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08L79/04C08L79/08C08K3/22C08K3/36C08K3/34C08K3/26C08G73/12B32B27/04B32B27/38B32B15/092
CPCB32B27/04B32B27/38C08G73/12C08K3/22C08K3/26C08K3/34C08K3/36C08L63/00C08L79/04C08L79/08
Inventor 周应先何岳山苏世国
Owner GUANGDONG SHENGYI SCI TECH
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