Photosensitive acrylic AED resin and negative photoresist composition comprising same, and preparation method thereof

A technology of photosensitive acrylic and photoresist, applied in the field of photosensitive acrylic AED resin, negative photoresist composition, the preparation of the composition, can solve the problem of poor adhesion, uneven film thickness, The problem of low degree of automation

Inactive Publication Date: 2014-05-28
JIANGYIN MORE CHEM NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional dry film method is commonly used in commercial photoresists. The photoresist prepared by the dry film method has a film layer and a copper surface that are bonded together by physical force. Often the film layer The thickness is not uniform enough, the adhesion is not good, resulting in defects in the circuit pattern, and the degree of automation is not high, which limits its application in the production of fine wires

Method used

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  • Photosensitive acrylic AED resin and negative photoresist composition comprising same, and preparation method thereof
  • Photosensitive acrylic AED resin and negative photoresist composition comprising same, and preparation method thereof
  • Photosensitive acrylic AED resin and negative photoresist composition comprising same, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] Example 1: Negative Photoresist Composition

[0086] Add 50g of ethylene glycol butyl ether (BCS) into a 250ml four-neck flask, stir at 85°C and add dropwise a mixed solution containing 24g of cyclohexyl vinyl ether, 40g of EHA, 40g of AA, 0.62g of AIBN and 0.31g of β-ME, within 3 hours Finish. After maintaining the reaction temperature for 1 hour, add 0.20 g of AIBN dissolved in 5 g of butyl acetate, drop it off within 0.5 hours, and maintain the reaction temperature for 2.5 hours to obtain an acrylic acid copolymer.

[0087] Then the temperature of the copolymer was raised to 105°C, and a mixture of 15.8 g GMA and 26.7 g BCS dissolved in 0.97 g triphenylphosphine (TPP), 1.20 g p-hydroxyanisole (MHEQ) was added dropwise, and the drop rate was controlled within 1 hour. The reactants except the solvent accounted for about 60% of the total feed, and the solvent accounted for the remaining 40%. After the dripping, the temperature was raised to 110°C, and the acid value wa...

Embodiment 2

[0089] Example 2: Negative Photoresist Composition

[0090] Mix 10g of the photosensitive acrylic AED base material in Example 1 with 0.11g of photoinitiator ITX, 0.15g of photosensitizer 907, and 1.2g of TMP(EO)3TA to form a homogeneous phase, then add 1.53g of triethylamine dropwise, stir well and drop slowly Add 63g of deionized water for emulsification, continue stirring after dripping, add 0.15g of water-based color paste after aging for 24 hours, and obtain a negative photoresist after stirring evenly.

Embodiment 3

[0091] Example 3: Negative Photoresist Composition

[0092] The temperature of the acrylic acid copolymer obtained in Example 1 was raised to 110°C, and a mixture of 31.6 g GMA and 37.5 g BCS dissolved in 0.84 g of triethylbenzyl ammonium chloride and 1.4 g of p-hydroxyanisole (MHEQ) was added dropwise to control the dropwise The dripping is completed within 1 hour, the reactants except the solvent account for about 60% of the total feed, and the solvent accounts for the remaining 40%. After the dripping is completed, the temperature rises to 115°C. The acid value is detected during the reaction, and the change within one hour does not exceed 2mgKOH / g , the reaction can be stopped to obtain a photosensitive acrylic AED base material.

[0093] Mix 10g of photosensitive acrylic AED base material with 0.32g of photoinitiator 1173 and 0.6g of TMP(EO)3TA to form a homogeneous phase, then add 1.02g of triethylamine dropwise, stir evenly, slowly add 63g of deionized water to emulsify...

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PUM

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Abstract

The invention discloses a negative photoresist composition which is prepared by an anodic electrodeposition process. The photoresist composition mainly contains deionized water, (A) a photosensitive acrylic AED (Anodic Electrodeposition) base material, (B) a polyfunctional reactive diluent, (C) antalkali, (D) a photo-initiation body and (E) a water-based colour paste. A photoresist has high degree of automation through an AED method, and a film layer is thin and compact, has uniform thickness, and is tightly combined with the surface of an electrode. The photoresist can have enough and strong adhesive force on a filament during refining, the reliability during development and etching can be increased, and VOC emission is reduced to a great extent. The photoresist material can be applied to the fields of etching-resisting imaging printing ink, color filters of liquid crystal displays and the like.

Description

technical field [0001] The invention belongs to the technical field of ultraviolet curing coatings. The present invention mainly relates to photosensitive acrylic AED resin. The invention also relates to a negative photoresist composition prepared by anodic electrodeposition process, and the negative photoresist composition includes photosensitive acrylic AED resin. And the invention also relates to a preparation method of the composition. Background technique [0002] Negative photoresist is a kind of photosensitive polymer solution. The exposed part is photocrosslinked under irradiation, and the unexposed part can be dissolved and washed away by alkaline developer. The alkali-soluble photoresist has the advantages of good adhesion, complete coverage, accurate alignment, high dimensional accuracy, convenient development and film removal, and environmental protection. It has become a type of photoresist widely studied for the production of fine wires. resist. [0003] Th...

Claims

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Application Information

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IPC IPC(8): C08F265/06C08F265/02C08F220/18C08F220/06C08F216/16C08F220/32G03F7/004G03F7/038G03F7/027
Inventor 何江川
Owner JIANGYIN MORE CHEM NEW MATERIALS
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