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Surface decoration processing method of electronic equipment housing

A technology for the surface of electronic equipment and casings, which is applied in the field of surface decoration and processing of electronic equipment casings, can solve the problems of complex structure, single decorative effect, unstable decorative layer, etc., and achieves the effect of not easy to crack and good gradient effect.

Active Publication Date: 2014-05-28
SUZHOU TAIKAN MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Due to the complex structure of this type of plastic parts, the surface decoration is limited to surface treatment processes such as spraying and NCVM (non-conductive plating), so the decorative effect is relatively simple, and some processing processes with more complex decorative effects may have some defects. resulting in instability of the decorative layer

Method used

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Embodiment Construction

[0033] Specific embodiments of the present invention will be further described in detail below.

[0034] A method for processing the surface of an electronic device shell, comprising the steps of:

[0035] 1. Insulation substrate film treatment

[0036] Nickel-tin alloy plating step, magnetron sputtering a layer of 50nm thick nickel-tin alloy layer on the printing surface on the 0.075mm thick insulating substrate film-PET film (polyethylene terephthalate film);

[0037] Plating a titanium oxide layer step, then further sputtering a layer of 50nm titanium oxide layer on the nickel-tin alloy layer;

[0038] In the voltage bombardment step, the titanium oxide layer is bombarded with a voltage of 800V for 2 minutes;

[0039] The step of printing ink is to print a layer of 0.003mm thick imperial IPX001 ink layer on the set area of ​​the titanium oxide layer bombarded by voltage, that is, the area that needs to have a semi-transparent NCVM effect;

[0040] In the baking step, the...

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Abstract

The invention discloses a surface decoration processing method of an electronic equipment housing, which comprises the following steps of nickel-tin alloy plating: a nickel-tin alloy layer is plated on an insulating substrate film, titanium oxide layer plating: a titanium oxide layer is plated on the nickel-tin alloy layer, voltage bombardment: the titanium oxide layer is bombarded via voltage, and ink printing: an ink layer is printed in a set area of the voltage bombarded titanium oxide layer. In some embodiments, the insulating substrate film is not easy to crack; the ink layer can be stably attached to the titanium oxide layer, so that a complete NCVM (non-conductive vacuum metallization) layer can be formed; and a stable and better gradient effect can be achieved. In certain embodiments, the side height of the manufactured electronic equipment housing can reach 9mm with a better gradient effect, and the surface hardness can reach 3-4H.

Description

【Technical field】 [0001] The invention relates to the field of electronic equipment casing processing, in particular to a method for processing the surface decoration of the electronic equipment casing. 【Background technique】 [0002] Since Apple launched touch-screen mobile phones in 2008, after five years of development, more than 80% of mobile phones are currently touch-screen mobile phones. After the capacitive screen matures in the past two years, touch-screen mobile phones are basically developing in a relatively thinner form. At present, mobile phones with 5-6 inch screen are the mainstream in the market, and the product thickness is 6-7mm. [0003] In 2010, Nokia launched the last influential model N9 using an integrated injection molding process. This process has been adopted by more and more mobile phone manufacturers under the current trend of thinning mobile phones. Due to the complex structure of this type of plastic parts, the surface decoration is limited to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B44C5/04
Inventor 易再希郭远军
Owner SUZHOU TAIKAN MACHINERY CO LTD
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