Copper clad laminate

Abstract

The invention discloses a copper clad laminate. The copper clad laminate comprises two conductor layers and a plurality of insulating medium layers which are arranged between the two conductor layers, wherein the plurality of insulating medium layers comprise at least one layer of modified crosslinking type PTFE (Polytetrafluoroethylene) resin combination bonding sheet, and a modified crosslinking type PTFE resin combination comprises modified crosslinking type PTFE resin containing a hydroxyl group and a resin containing a carbamate group, an amino group and / or an epoxy group. With the adoption of the copper clad laminate, as the dielectric constant and the dielectric loss of the copper clad laminate can be controlled by changing the content of the modified crosslinking type PTFE resin, the copper clad laminate has low and stable dielectric constant and lower dielectric loss; the copper clad laminate has the advantages that the manufacturing is simple, the process is feasible, and the cost is low.

Description

technical field [0001] The invention relates to the field of copper-clad laminates, in particular to a copper-clad laminate suitable for high-frequency and high-speed transmission. Background technique [0002] Copper Clad Laminate (CCL for short) is made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with epoxy or phenolic resin, covered with copper foil on one or both sides, and cured by hot pressing. product. [0003] Copper clad laminates are the basic materials of the electronics industry, mainly used for processing and manufacturing printed circuit boards (PCBs), and are widely used in electronic products such as televisions, radios, computers, computers, and mobile communications. [0004] The development of high-frequency and high-speed transmission technology of electronic product signals depends on two important properties of printed circuit board substrate materials: low and stable dielectric constant (Dk) and as low as possible di...

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Problems solved by technology

Such as the Chinese invention patent (application number: 201010181737.X) fluororesin mixture, copper clad laminate made by using it and its production method. This method of producing copper clad laminate has complex process, high sintering temperature (300-380 ℃), pressing Disadvantages such as high temperature (300-380°C); Chinese invention patent (application number: 200910106385.9) preparation method of low-loss high-frequency copper-clad laminates, directly preparing copper-clad foils by direct lamination of polytetrafluoroethylene film and glass fiber cloth The laminated board replaces the traditional glass fiber cloth as the reinforcing material, and the polytetrafluoroethylene dispersion impregnation process simplifies the process, but at the same time it brings problems of poor wettability between polytetrafluoroethylene and glass fiber cloth, and poor adhesion between copper foil and the board. Disadvantages: China Invention Patent (Application No.: 201010283828.4) epoxy resin composition and the copper clad laminate made of it, using polytetrafluoroethylene powder to reduce the water absorption rate of the board, but due to the low polarity of polytetrafluoroethylene powder, it has no effect on adhesion It has an impact and also limits the amount of PTFE powder; Chinese invention patent (application number: 201210283315.2) copper clad laminate, the insulating medium layer includes at least one layer of porous PTFE film and at least one layer of thermosetting resin bonding sheet, covered The adhesion between the layers of the copper foil laminate is good, and the dielectric constant and dielectric loss of the copper clad laminate can be adjusted by the thickness and number of porous PTFE films, so that it has a low and stable dielectric strength. constant and lower dielectric loss

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