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Diffusion bonding method for tungsten and copper dissimilar metal

A technology of diffusion joining and dissimilar metals, applied in the field of diffusion joining of dissimilar alloys, to achieve the effect of simple process operation, strong applicability and good joining performance

Inactive Publication Date: 2014-04-09
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above method uses Ni as the intermediate transition layer, because Ni absorbs a large amount of neutrons, it is not suitable for direct contact with the first wall as the intermediate transition layer

Method used

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  • Diffusion bonding method for tungsten and copper dissimilar metal
  • Diffusion bonding method for tungsten and copper dissimilar metal
  • Diffusion bonding method for tungsten and copper dissimilar metal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1. The industrial pure tungsten with a size of Φ20mm×1mm is polished and smoothed step by step with metallographic sandpaper, polished, and the oxide layer is removed, and then ultrasonically cleaned with acetone, alcohol, and deionized water for 15 minutes, dried, and set aside.

[0032] 2. The copper sheet with a size of Φ20mm×3mm and the copper foil with a size of Φ20mm×30μm are electrochemically polished with a mixture of phosphoric acid and ethanol with a volume ratio of 8:1, and the current density is 20A / dm 2 , the polishing time is 10min, blow dry, and set aside.

[0033] 3. Use the electrochemically polished copper foil in step 2 as the substrate, seal one side of the copper foil with conductive glue and tape, and put it into the electroplating solution. The electroplating solution is composed of sodium tungstate, ferrous sulfate, ammonium tartrate and Water composition, the mass volume concentration of sodium tungstate, ferrous sulfate and ammonium tartrate ar...

Embodiment 2

[0040] 1. The industrial pure tungsten with a size of Φ20mm×1mm is polished and smoothed step by step with metallographic sandpaper, polished, and the oxide layer is removed, and then ultrasonically cleaned with acetone, alcohol, and deionized water for 15 minutes, dried, and set aside.

[0041] 2. The copper sheet with a size of Φ20mm×3mm and the copper foil with a size of Φ20mm×30μm are electrochemically polished with a mixture of phosphoric acid and ethanol with a volume ratio of 10:1, and the current density is 40A / dm 2 , polishing time 5min, blow dry, set aside.

[0042] 3. Use the electrochemically polished copper foil in step 2 as the substrate, seal one side of the copper foil with conductive glue and tape, and put it into the electroplating solution. The electroplating solution is composed of sodium tungstate, ferrous sulfate, ammonium tartrate and water. Composition, the mass volume concentrations of sodium tungstate, ferrous sulfate and ammonium tartrate are 75g / L, ...

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Abstract

The invention provides a diffusion bonding method for tungsten and copper dissimilar metal. The diffusion bonding method includes steps of (1), electrochemically polishing copper sheets and copper foils; (2), encapsulating the surface of one side of each electromechanically polished copper foil, then electroplating the copper foils in electroplate liquid and acquiring an amorphous Fe-W coating on the surface of the other side of each copper foil; (3), sequentially overlapping each copper sheet, the corresponding copper foil and a tungsten sheet from bottom to top to obtain a combination, and performing vacuum hot-pressed sintering on the combinations so as to implement diffusion bonding on the tungsten and copper dissimilar metal. The electroplate liquid comprises sodium tungstate, ferrous sulfate, ammonium tartrate and water. The side surfaces of the amorphous Fe-W coatings of the copper foils are in contact with the tungsten sheets. The diffusion bonding method has the advantages of simplicity in technological operation, low cost, high applicability, good connection performance and tensile strength which is higher than 146MPa.

Description

technical field [0001] The invention relates to a diffusion connection method of dissimilar alloys, in particular to a diffusion connection method of tungsten and copper. Background technique [0002] Because of its high sputtering threshold, high melting point, and high resistance to plasma erosion in low-energy regions, metal tungsten is the most promising material for the back plate of fusion reactor divertors; metal copper has excellent thermal conductivity and good processing And welding performance, the combination of the two will be suitable as a heat sink material used in the harsh environment of the divertor. However, tungsten and copper are two metals with very different thermophysical properties, mainly manifested in the mismatch of thermal expansion coefficients (about 12×10 -6 / °C) and a huge melting point difference (2327°C). The difference in thermal expansion coefficient will directly lead to a large residual stress in the joint, which seriously affects the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/02B23K20/14B23K20/24
CPCB23K20/023B23K20/14B23K20/24
Inventor 凌云汉王松
Owner TSINGHUA UNIV
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