Cleaning treatment method for n-type crystalline silicon substrate of solar cell
A technology of a solar cell and a processing method, applied in the field of device manufacturing, can solve the problems of low open-circuit voltage and short-circuit current of devices, high surface recombination rate of carriers, and poor surface passivation, etc.
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[0025] In order to make the content of the present invention more clearly understood, the present invention will be further described in detail below based on specific embodiments and in conjunction with the accompanying drawings.
[0026] Such as figure 1 Shown, the cleaning processing method of the N-type crystalline silicon substrate of a kind of solar cell, the steps of this method are as follows:
[0027] (1) N-type silicon wafer texturing + H 2 SO 4 / H 2 o 2 Pre-cleaning: Rinse the N-type crystalline silicon substrate after texturing with deionized water, and then immerse it in a mixed solution of concentrated sulfuric acid and hydrogen peroxide for 5-15 minutes, and keep the temperature at 80-100°C. Rinse the substrate with deionized water for approximately 2.5 minutes; the ratio of concentrated sulfuric acid to hydrogen peroxide is 1:1 to 1:4;
[0028] (2) HF / HCL impregnation: then soak the substrate in a mixed solution containing 2% hydrochloric acid and 3% hydro...
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