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High-reliability stackable and high-speed SOI diode

A diode and reliable technology, applied in the field of high-reliability stackable high-speed SOI diodes, can solve problems such as insufficient withstand voltage level, long response time, and insufficient sensitivity, and achieve the effects of small production impact, simple operation, and reduced reverse dark current

Inactive Publication Date: 2014-03-26
WUXI ZHONGWEI JINGYUAN ELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The SOI diode with the original structure has insufficient withstand voltage level, large dark current, large junction capacitance, long response time, and insufficient sensitivity. How to meet the needs of high-speed and high-reliability diodes is the consideration of the present invention.

Method used

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with specific drawings.

[0022] Such as Figure 9 Shown: the high-reliability stackable high-speed SOI diode of the present invention includes an SOI substrate 1, and the SOI substrate 1 includes Si / SiO 2 / Si three-layer structure, the Si layer on the upper part of the SOI substrate 1 is provided with an N+ doped region 2, and the N+ doped region 2 is from the upper surface of the Si layer on the upper part of the SOI substrate 1 to the SiO in the middle of the SOI substrate 1 2 layer extension, and the thickness of the N+ doped region 2 is less than or equal to the thickness of the Si layer on the top of the SOI substrate 1; an N- epitaxial layer 3 is set on the upper surface of the SOI substrate 1, and an annular groove is set on the N-epitaxial layer 3 Groove 4, the groove 4 extends from the upper surface of the N- epitaxial layer 3 to the SiO in the middle of the SOI substrate 1 2 Fill the trenc...

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Abstract

The invention relates to a high-reliability stackable and high-speed SOI diode. The high-reliability and stackable high-speed SOI diode comprises an SOI substrate. The high-reliability stackable and high-speed SOI diode is characterized in that the Si layer on the upper portion of the SOI substrate is provided with a first conduction type doping area extending to the SiO2 layer in the middle of the SOI substrate from the upper surface of the SOI substrate; the upper surface of the SOI substrate is provided with a first conduction type epitaxial layer in which an annular groove is formed, the groove extends to the SiO2 layer in the middle of the SOI substrate from the upper surface of the first conduction type epitaxial layer, the groove is filled with polycrystalline silicon, and a first monox layer is arranged between the side wall of the groove and the polycrystalline silicon; second monox layers are respectively arranged on the upper surface of the groove; the parts, on the two sides of the groove of the first conduction type epitaxial layer and the SOI substrate are provided with the first conduction type doping area, and the upper portion of the first conduction type epitaxial layer is provided with a second conduction type doping area. The high-reliability stackable and high-speed SOI diode overcomes the defects of an existing SOI diode in the aspects of frequency and pressure resistance, and the high-reliability and high-speed SOI diode can be achieved.

Description

technical field [0001] The invention relates to a high-reliability stackable high-speed SOI diode, which belongs to the technical field of semiconductors. Background technique [0002] With the development of microelectronic technology, SOI devices are widely used. Due to the advantages of low power consumption, anti-radiation, and anti-latch-up characteristics of SOI technology, SOI technology has gradually become the mainstream technology for manufacturing high-speed, low-power, high-reliability integrated circuits, and the use of SOI diodes is also increasing. more attention. With the use of SOI diodes in fields such as radio frequency and optoelectronics, the structure of conventional SOI diodes has been continuously updated. The SOI diode with the original structure has insufficient withstand voltage level, large dark current, large junction capacitance, long response time, and insufficient sensitivity. How to meet the needs of high-speed and high-reliability diodes i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/861H01L29/06
CPCH01L29/861H01L29/0603H01L29/0684H01L29/6609
Inventor 张明高向东唐剑平潘建华
Owner WUXI ZHONGWEI JINGYUAN ELECTRONIC CO LTD
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