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Copper plating solution for PCB (printed circuit board) through holes and PCB blind holes, as well as preparation method and plating method of copper plating solution

A technology of electroplating copper and solution, which is applied in the direction of electrical connection formation of printed components

Inactive Publication Date: 2014-02-12
东莞市富默克化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The electroplating solution in the prior art can only electroplate one of PCB through holes or PCB blind holes. At present, there is no common solution for electroplating PCB through holes and PCB blind holes on the market.

Method used

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  • Copper plating solution for PCB (printed circuit board) through holes and PCB blind holes, as well as preparation method and plating method of copper plating solution
  • Copper plating solution for PCB (printed circuit board) through holes and PCB blind holes, as well as preparation method and plating method of copper plating solution
  • Copper plating solution for PCB (printed circuit board) through holes and PCB blind holes, as well as preparation method and plating method of copper plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] A copper electroplating solution for through-hole blind holes of PCB, each component and content thereof of the copper electroplating solution are:

[0093] Copper sulfate pentahydrate: 100g / L

[0094] Sulfuric acid: 100g / L

[0095] Chloride ion: 30ppm

[0096] Brightener: 5g / L

[0097] Carrier: 3g / L

[0098] Leveling agent: 2g / L

[0099] Deionized water balance;

[0100] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1:1.

[0101] The brightener is a mixture of sodium 3-mercapto-1-propanesulfonate and ethylene thiourea with a weight ratio of 1.5:1; the carrier is made of polyethylene glycol with a molecular weight of 5000 and A mixture of polypropylene glycol in a weight ratio of 1.8:1.

[0102] The leveling agent is a mixture of leveling agent A and leveling agent B with a weight ratio of 1.2:1; wherein, the leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and the leveling agent B is N- Vinyl-N'-butylimid...

Embodiment 2

[0121] A copper electroplating solution for through-hole blind holes of PCB, each component and content thereof of the copper electroplating solution are:

[0122] Copper sulfate pentahydrate: 140g / L

[0123] Sulfuric acid: 120g / L

[0124] Chloride ion: 45ppm

[0125] Brightener: 15g / L

[0126] Carrier: 10g / L

[0127] Leveling agent: 5g / L

[0128] Deionized water balance;

[0129] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.17:1.

[0130] The brightener is a mixture of sodium 3-mercapto-1-propanesulfonate and ethylene thiourea in a weight ratio of 2:1; the carrier is made of polyethylene glycol with a molecular weight of 8000 and A mixture of polypropylene glycol in a weight ratio of 2:1.

[0131] The leveling agent is a mixture of leveling agent A and leveling agent B with a weight ratio of 1.5:1; wherein, the leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and the leveling agent B is N- Vinyl-N'-butylimida...

Embodiment 3

[0150] A copper electroplating solution for through-hole blind holes of PCB, each component and content thereof of the copper electroplating solution are:

[0151] Copper sulfate pentahydrate: 220g / L

[0152] Sulfuric acid: 180g / L

[0153] Chloride ion: 80ppm

[0154] Brightener: 35g / L

[0155] Carrier: 20g / L

[0156] Leveling agent: 15g / L

[0157] Deionized water balance;

[0158] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.22:1.

[0159] The brightener is a mixture of sodium 3-mercapto-1-propanesulfonate and ethylene thiourea with a weight ratio of 2.5:1; the carrier is made of polyethylene glycol with a molecular weight of 10000 and A mixture of polypropylene glycol in a weight ratio of 2.2:1.

[0160]The leveling agent is a mixture of leveling agent A and leveling agent B with a weight ratio of 1.8:1; wherein, the leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and the leveling agent B is N- Vinyl-N'-but...

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Abstract

The invention relates to the technical field of PCB (printed circuit board) plating, in particular to a copper plating solution for PCB through holes and PCB blind holes, and a preparation method and a plating method of the copper plating solution. Each liter of the copper plating solution comprises the following components according to contents: 100-250g of copper sulfate pentahydrate, 100-200g of sulfuric acid, 30-100ppm of chlorine ions, 5-50g of brightener, 3-30g of carrier, 2-20g of leveling agent and the balance of deionized water, wherein the concentration ratio of the copper sulfate pentahydrate to the sulfuric acid is (1-1.25) : 1. The plating method comprises the following steps: putting a PCB with through holes and blind holes into a plating bath with the copper plating solution; plating during air agitation to obtain a copper plating layer. The copper plating layer formed by the plating method has a good deep plating capability as high as 92% above, has a hole-filling rate as high as 96% above, and is dense, smooth, relatively good in malleability, good in gloss, high in toughness and low in internal stress.

Description

technical field [0001] The invention relates to the technical field of PCB electroplating, in particular to a copper electroplating solution for PCB through-hole blind holes, a preparation method thereof, and an electroplating method. Background technique [0002] During the production process of printed circuit board (PCB), through holes and blind holes will be made. Through holes are drilled with mechanical drills and drill pins. Blind holes are ablated by laser drilling machines. Through holes It is used to realize the conduction interconnection between any layers in the multilayer board, and the blind hole is used to realize the conduction interconnection between the outer layer and the sublayer in the multilayer board. [0003] In the follow-up copper sulfate electroplating technology of printed circuit board (PCB), the requirements for electroplating for through holes and blind holes on the circuit board are different. , to improve the deep plating ability (though pow...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/00H05K3/42
Inventor 王维仁伊洪坤
Owner 东莞市富默克化工有限公司
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