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Method for preparing super-hydrophilic structure on red copper surface and red copper micro-heat tube manufactured by using same

A super-hydrophilic, red copper micro-technology, applied in heat transfer modification, heat exchange equipment, indirect heat exchangers, etc., can solve the problems of large influence by gravity, complex manufacturing process, small capillary force of absorbent core, etc. The effect of reducing processing cost, solving processing difficulties and improving thermal conductivity

Active Publication Date: 2014-02-05
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The micro-heat pipe with grooved liquid-absorbing core structure is 30%-40% lighter than the micro-heat pipe with sintered liquid-absorbing core structure, and the working medium liquid backflow resistance is small, but the liquid-absorbing core has small capillary force and is affected by gravity. Large and complex manufacturing process and other disadvantages

Method used

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  • Method for preparing super-hydrophilic structure on red copper surface and red copper micro-heat tube manufactured by using same
  • Method for preparing super-hydrophilic structure on red copper surface and red copper micro-heat tube manufactured by using same
  • Method for preparing super-hydrophilic structure on red copper surface and red copper micro-heat tube manufactured by using same

Examples

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Embodiment 1

[0044] A method for preparing a copper surface super-hydrophilic structure, comprising the following steps:

[0045] (1) Preparation of electrolyte

[0046] Dissolving copper sulfate pentahydrate crystals in deionized water to form CuSO 4 solution, and then to CuSO 4 Concentrated H was added to the solution 2 SO 4 , will give CuSO 4 and H 2 SO 4 The mixed solution is used as the electrolyte, the copper ion concentration is preferably 0.02mol / L, and the hydrogen ion concentration is preferably 1mol / L.

[0047] (2) Copper surface pretreatment

[0048] The surface of red copper (copper element content greater than 99.9%) is ultrasonically cleaned with dilute sulfuric acid and ethanol in sequence, rinsed with deionized water, and then dried naturally in the air.

[0049] (3) Electrochemical deposition to construct micro-nano rough structure

[0050] The red copper pretreated in step (2) is used as the cathode and anode of the electrochemical reaction, immersed in the elec...

Embodiment 2

[0055] A method for preparing a copper surface super-hydrophilic structure, comprising the following steps:

[0056] Dissolving copper sulfate pentahydrate crystals in deionized water to form CuSO 4 solution, and then to CuSO 4 Concentrated H was added to the solution 2 SO 4 , will give CuSO 4 and H 2 SO 4 The mixed solution is used as the electrolyte, the copper ion concentration is preferably 0.02mol / L, and the hydrogen ion concentration is preferably 1mol / L.

[0057] (2) Copper surface pretreatment

[0058] The copper surface was ultrasonically cleaned with dilute sulfuric acid and ethanol in turn, rinsed with deionized water, and then dried naturally in the air.

[0059] (3) Electrochemical deposition to construct micro-nano rough structure

[0060] The red copper pretreated in step (2) is used as the cathode and anode of the electrochemical reaction, immersed in the electrolyte prepared in step (1), the cathode red copper is connected to the negative electrode of ...

Embodiment 3

[0065] A method for preparing a copper surface super-hydrophilic structure, comprising the following steps:

[0066] Dissolving copper sulfate pentahydrate crystals in deionized water to form CuSO 4 solution, and then to CuSO 4 Concentrated H was added to the solution 2 SO 4 , will give CuSO 4 and H 2 SO 4 The mixed solution is used as the electrolyte, the copper ion concentration is preferably 0.02mol / L, and the hydrogen ion concentration is preferably 1mol / L.

[0067] (2) Copper surface pretreatment

[0068] The copper surface was ultrasonically cleaned with dilute sulfuric acid and ethanol in turn, rinsed with deionized water, and then dried naturally in the air.

[0069] (3) Electrochemical deposition to construct micro-nano rough structure

[0070] The red copper pretreated in step (2) is used as the cathode and anode of the electrochemical reaction, immersed in the electrolyte prepared in step (1), the cathode red copper is connected to the negative electrode of ...

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Abstract

The invention discloses a method for preparing a super-hydrophilic structure on a red copper surface and a red copper micro-heat tube manufactured by using the method. The method for preparing the red copper super-hydrophilic structure comprises the following four steps: preparing electrolyte, performing red copper surface pretreatment, constructing a micro-nano rough structure in an electrochemical deposition mode, and sintering. The contact angle of the super-hydrophilic structure prepared by using the method and water is 5-0 degree, and moreover the super-hydrophilic structure has good stability and high boundary binding strength, and can be used as a super-hydrophilic layer to be applied to the red copper micro-heat tube. Due to the good super-hydrophilic property, the heat conduction coefficient of the red copper micro-heat tube and the capillary force of the super-hydrophilic layer are greatly improved. By adopting the method, the conventional difficult problem in machining the red copper micro-heat tube is solved, and the method is simple and easy to control in process, low in cost and applicable to popularization.

Description

technical field [0001] The invention relates to the field of electrochemical machining of metal surface microstructures. Background technique [0002] The wettability of solid surfaces is very important for both basic research and practical applications. In recent years, the phenomena of superhydrophilicity and superhydrophobicity on solid surfaces have received extensive attention. A superhydrophilic surface refers to a surface whose contact angle with water is less than 5°. The superhydrophilic surface has many excellent properties, such as self-cleaning, anti-fog, biomedicine, and improving surface heat exchange efficiency. Most solid surfaces in nature are hydrophilic, but in order to achieve superhydrophilicity, it is necessary to further construct the surface microstructure. At present, there have been many studies and achievements on superhydrophobic copper surfaces, but there are still few studies on superhydrophilic structures on copper surfaces, especially how to...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/50C25D7/04F28F13/18F28D15/04
Inventor 汤勇刘侨鹏袁伟陆龙生万珍平付婷
Owner SOUTH CHINA UNIV OF TECH
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