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Adhesive for adhering silicon rods

An adhesive and bonding technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve problems such as low reliability, poor heat resistance and corrosion resistance, poor bonding stability, etc., and achieve reliability Strong, reduced tailings, high bonding strength

Active Publication Date: 2015-05-13
广西珀源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing adhesives have poor bonding stability and low reliability, and the existing adhesives generally have the problems of poor heat resistance and corrosion resistance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The resin component described in the adhesive used for bonding silicon rods of the present invention includes: 40 parts by weight of epoxy resin E51, for example, one selected from Hansen's corresponding grade E828 and Dow's corresponding grade D E R331 Kind, its epoxy equivalent is 182-192, and 35 parts by weight of novolac epoxy resin F-44, with 5 parts by weight of titanium oxide, 18 parts by weight of quartz powder, 1.5 parts by weight of γ-glycidyl ether propyl trimethyl Oxysilane, 0.5 parts by weight of fumed silica.

[0024] The curing agent component includes: 38 parts by weight of novolak epoxy resin modified m-xylylenediamine prepolymer, 42 parts by weight of diethylenetriamine, 17.5 parts by weight of 2,4,6-tri(dimethylamino) Methyl) phenol and 2.5 parts by weight of fumed silica. Wherein said novolac epoxy resin modified m-xylylenediamine prepolymer comprises: 70 parts by weight of m-xylylenediamine, 2 parts of 2,4,6-tris(dimethylaminomethyl)phenol and 28 p...

Embodiment 2

[0032] The resin component described in the adhesive used for bonding silicon rods of the present invention includes: 35 parts by weight of epoxy resin E51, for example, one selected from Hansen's corresponding grade E828 and Dow's corresponding grade D E R331 Kind, its epoxy equivalent is 182-192, and the novolac epoxy resin F-44 of 40 parts by weight, the quartz powder of 35 parts by weight, the gamma-glycidyl ether propyl trimethoxysilane of 1.5 parts by weight, 0.5 parts by weight of fumed silica.

[0033] The curing agent component includes: 40 parts by weight of novolac epoxy resin modified m-xylylenediamine prepolymer, 45 parts by weight of diethylenetriamine, 20 parts by weight of 2,4,6-tri(dimethylamino) Methyl) phenol and 2 parts by weight of fumed silica. Wherein said novolak epoxy resin modified m-xylylenediamine prepolymer comprises: 80 parts by weight of m-xylylenediamine, 5 parts of 2,4,6-tris(dimethylaminomethyl)phenol and 30 parts by weight Parts of epoxy no...

Embodiment 3

[0041] The resin component described in the adhesive used for bonding silicon rods of the present invention includes: 35 parts by weight of epoxy resin E51, for example, one selected from Hansen's corresponding grade E828 and Dow's corresponding grade D E R331 Kind, its epoxy equivalent is 182-192, and the novolac epoxy resin F-44 of 35 parts by weight, the titanium oxide of 5 parts by weight, the quartz powder of 30 parts by weight, the gamma-glycidyl ether propyl trimethyl of 1.5 parts by weight Oxysilane, 0.5 parts by weight of fumed silica.

[0042] The curing agent component includes: 30 parts by weight of novolac epoxy resin modified m-xylylenediamine prepolymer, 40 parts by weight of diethylenetriamine, 15 parts by weight of 2,4,6-tri(dimethylamino Methyl) phenol and 2 parts by weight of fumed silica. Wherein said novolac epoxy resin modified m-xylylenediamine prepolymer comprises: 60 parts by weight of m-xylylenediamine, 2 parts of 2,4,6-tris(dimethylaminomethyl)pheno...

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PUM

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Abstract

The invention provides an adhesive for adhering silicon rods, and a preparation method of the adhesive. The adhesive comprises a resin component and a curing agent component, wherein the curing agent component comprises the ingredients, such as novolac epoxy resin modified m-xylylenediamine prepolymer, 2, 4, 6-tri(dimethylamino methyl) phenol and a thixotropic agent. The adhesive provided by the invention has the characteristics of high temperature resistance, corrosion resistance, high rigidity, high reliability and the like.

Description

technical field [0001] The invention relates to an adhesive, more particularly to a heat-resistant, corrosion-resistant, high-hardness adhesive used for bonding silicon rods. Background technique [0002] In the photovoltaic solar slicing process, due to various reasons, a large number of complete silicon rods will be broken or partially broken, and a large part of them can be cut to obtain complete silicon wafers. If they are treated as waste silicon materials, a lot of resources will be wasted. If the broken or partially broken silicon rods are rebonded and then cut, the yield of silicon wafers will be increased and the generation of tailings will be reduced. However, the existing adhesives have poor bonding stability and low reliability, and the existing adhesives generally have the problems of poor heat resistance and corrosion resistance. Contents of the invention [0003] In view of the above problems, the object of the present invention is to provide a heat-resista...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/04C09J11/08C09J11/06C09J11/04
Inventor 苏光临韦祖睦陈韬
Owner 广西珀源新材料有限公司
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