Pretreatment method for silicon carbide powder sample to be tested by using laser ablation inductively coupled plasma mass spectrometry
A silicon carbide powder and laser ablation technology, applied in the field of analytical chemistry, can solve problems such as poor viscosity, detection of elements affecting the content and distribution, etc., and achieve the effect of good application prospects.
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Embodiment 1
[0037] Weigh 1.0 g of silicon carbide (micron particle size), grind and sieve (200 mesh). Use manual tablet press, holding time 30s, pressure is 10Mpa, it is prepared into of small discs. The prepared silicon carbide wafer was sintered in a muffle furnace at a temperature of 1000°C, and the temperature was programmed to rise from room temperature to 500°C after 1.5 hours; then, the temperature was raised from 500°C to 500°C after 1.5 hours. to 1000°C; keep at 1000°C for 2 hours; then cool down from 1000°C to 500°C in 1.5 hours; finally cool down from 500°C to room temperature in 1.5 hours. After sintering, it was measured by laser ablation inductively coupled plasma mass spectrometry.
Embodiment 2
[0039] Weigh 1.0 g of silicon carbide (nanoscale particle size), grind and sieve (200 mesh). Use manual tablet press, holding time 30s, pressure is 10Mpa, it is prepared into of small discs. The prepared silicon carbide wafer was sintered in a muffle furnace at a temperature of 1000°C, and the temperature was programmed to rise from room temperature to 500°C after 1.5 hours; then, the temperature was raised from 500°C to 500°C after 1.5 hours. to 1000°C; keep at 1000°C for 2 hours; then cool down from 1000°C to 500°C in 1.5 hours; finally cool down from 500°C to room temperature in 1.5 hours. After sintering, it was measured by laser ablation inductively coupled plasma mass spectrometry.
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