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Method for preparing nano-silica-boron modified phenolic resin

A technology of nano-silica and phenolic resin, applied in the field of phenolic resin, can solve the problems of limited improvement of mechanical properties and achieve good heat resistance

Inactive Publication Date: 2013-12-25
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Boric acid is an inorganic compound. According to research, boric acid modified phenolic resin can greatly improve the thermal performance of phenolic resin, but the improvement of mechanical properties is limited.

Method used

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  • Method for preparing nano-silica-boron modified phenolic resin
  • Method for preparing nano-silica-boron modified phenolic resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] One, the preparation of nano silica-boron modified phenolic resin:

[0027] The first step, nano-silica modification;

[0028] nano-SiO 2 Put it into an electric constant temperature blast drying oven and dry it at 60°C for 24h. Weigh 6g of nano-SiO 2 , pour it into a three-necked flask containing a mixed solution of absolute ethanol and deionized water, and ultrasonically disperse for 1 hour; take 1.2g of silane coupling agent γ-methacryloxypropyltrimethoxysilane (KH-570) Dissolve in the mixed solution of oxalic acid solution with pH 3.5 and absolute ethanol, stir it magnetically for 1 hour, pour it into a three-necked flask that has been ultrasonicated, and stir at 85°C for 5 hours. Finally, the obtained emulsion was washed with a mixed solution of absolute ethanol and deionized water, centrifuged at 15° C. and 10,000 rpm for 15 minutes, and repeated 3 times to remove excess silane coupling agent γ-methacryloxypropyltrimethoxysilane ( KH-570) and by-products, and ...

Embodiment 2

[0043] One, the preparation of nano silica-boron modified phenolic resin:

[0044] The first step, nano-silica modification;

[0045] nano-SiO 2 Put it into an electric constant temperature blast drying oven and dry it at 60°C for 24h. Weigh 6g of nano-SiO 2 , pour it into a three-necked flask containing a mixed solution of absolute ethanol and deionized water, and ultrasonically disperse for 1 hour; take 0.6g of silane coupling agent γ-methacryloxypropyltrimethoxysilane (KH-570) Soluble in the mixed solution of oxalic acid solution with a pH of about 3.5 and absolute ethanol with a volume ratio of 1:1, and then pour it into a three-necked flask that has completed ultrasonication at one time after magnetic stirring for 1 hour, and react at a constant temperature of 85°C for 5 hours . Finally, the obtained emulsion was washed with a mixed solution of absolute ethanol and deionized water, centrifuged at 10° C. and 12000 rpm for 20 min, and repeated 3 times to remove excess s...

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Abstract

The invention discloses a method for preparing nano-silica-boron modified phenolic resin, and relates to phenolic resin. Firstly, a silane coupling agent gamma-methylacryloyl acyloxy propyl group trimethoxy silane is adopted to modify hydrophilic nano-silicon to obtain hydrophobic nano-silica. Secondly, reaction is carried out on phenol and formaldehyde under the condition that sodium hydroxide serves as catalyst to obtain phenolic resin emulsion, and the modified nano-silicon which is dispersed by anhydrous ethanol solution in an ultrasonic mode is added to the phenolic resin emulsion to be reacted. Lastly, boric acid is added, polymerization reaction is carried out on the phenolic resin micromolecule and the boric acid, and the nano-silica-boron modified phenolic resin is prepared. The nano-silica is added with part organo-functional groups through silane coupling agent gamma-methylacryloyl acyloxy propyl group trimethoxy silane so that the problems that the nano-silica is poor in dispersity, solubleness and machinability can be solved. The carbon yield of the prepared nano-silica-boron modified phenolic resin is 72.40%, and the thermal performance is improved by about 5% compared with the thermal performance of ordinary boron modified phenolic resin.

Description

technical field [0001] The invention relates to phenolic resins, in particular to a preparation method of nanometer silicon dioxide-boron modified phenolic resins. Background technique [0002] Phenolic resin, commonly known as bakelite powder, is a large class of synthetic resins obtained by polycondensation of phenolic compounds and aldehyde compounds. It is one of the three thermosetting resins alongside epoxy resin and unsaturated polyamine resin. One of the earliest synthetic resins. Phenolic resin is widely used because of its cheap raw material, heat and flame resistance, low toxicity, good chemical stability, strong acid resistance, and stable product size. However, with the development of society, the requirements for resin performance are getting higher and higher. Therefore, there are more and more modifications of phenolic resins. [0003] As a new type of material, nanomaterials have developed into one of the three new industries in the 21st century together ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/14C08G8/28C08G8/10C08K9/06C08K3/36
Inventor 肖宗源易新龙侯睿邵文尧
Owner XIAMEN UNIV
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