Method for improving teflon adhesive property and method for producing pressure-sensitive adhesive tape
A polytetrafluoroethylene and polytetrafluoroethylene technology, which is applied in the field of improving the adhesion performance of polytetrafluoroethylene, can solve the problems that the surface adhesion performance of polytetrafluoroethylene cannot be significantly improved, and can reduce the quantity and curb degradation. , Improve the effect of bonding performance
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Embodiment 1
[0050] The method for improving the bonding performance of polytetrafluoroethylene comprises the steps:
[0051] Cleaning step: using at least one of methanol, ethanol, isopropanol, acetone, and toluene to clean the polytetrafluoroethylene substrate by ultrasonic oscillation;
[0052] Atmospheric-pressure low-temperature plasma treatment step: use the atmospheric-pressure glow-based atmospheric-pressure low-temperature plasma technology to treat the cleaned polytetrafluoroethylene substrate.
[0053] In the normal-pressure low-temperature plasma treatment step, an existing plasma method can be used to treat the polytetrafluoroethylene substrate. Since the influence of powder, irregularities and dust is avoided, the bonding ability of PTFE substrates can be improved even with the existing plasma method.
Embodiment 2
[0055] Use polytetrafluoroethylene turning film, the degree of orientation is 2.0, and the film thickness is 0.05mm.
[0056] The method for improving the bonding performance of polytetrafluoroethylene comprises the steps:
[0057] Cleaning steps: use ethanol to clean the polytetrafluoroethylene substrate by ultrasonic vibration, and the cleaning time is 2 minutes;
[0058] Atmospheric pressure low-temperature plasma treatment steps: use "a low-temperature plasma system based on atmospheric pressure glow" disclosed in the invention patent with the application number "200910058641.1" to carry out surface treatment on the cleaned PTFE substrate, and the discharge parameters and processing conditions are as follows.
[0059] Table 1
[0060] discharge voltage Discharge current discharge frequency processing time 9.5kV 1.1mA / cm 2 15kHz 25S
[0061] The working gas is argon, the flow rate of the working gas is 20L / min, and the working gas is mixed w...
Embodiment 3
[0064] Use polytetrafluoroethylene turning film, the degree of orientation is 2.0, and the film thickness is 0.05mm.
[0065] Cleaning steps: use ethanol to clean the polytetrafluoroethylene substrate by ultrasonic vibration, and the cleaning time is 2 minutes;
[0066] Atmospheric pressure low-temperature plasma treatment steps: use "a low-temperature plasma system based on atmospheric pressure glow" disclosed in the invention patent with the application number "200910058641.1" to carry out surface treatment on the cleaned PTFE substrate, and the discharge parameters and processing conditions are as follows.
[0067] Table 2
[0068] discharge voltage Discharge current discharge frequency processing time 9.5kV 1.2mA / cm 2 15kHz 25S
[0069] The working gas is argon, the flow rate of the working gas is 20L / min, and the working gas is mixed with 1% oxygen by mass. Air impurities are mixed in the gas in the discharge chamber, and the signal-to-noi...
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