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A kind of electronic paste for patch fuse fuse and its manufacturing method

A technology of electronic paste and fuse, applied in the direction of conductive materials, circuits, electrical components, etc. dispersed in non-conductive inorganic materials, can solve the problems of easily oxidized resistivity, no protective components, increase, etc. Prevention of breaking failure, prevention of oxidation, good coating effect

Active Publication Date: 2016-01-20
NANJING SART SCI & TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The melting point of copper and nickel metals is higher than that of silver, which has greater advantages than silver in terms of anti-pulse ability, but the disadvantage is that copper and nickel metals are easily oxidized during long-term use, which increases their own resistivity
At present, there have been extensive researches at home and abroad on the technology of applying silver-plated copper powder and silver-plated nickel powder to conductive adhesives, coatings and other products, but there are no reports related to the application of protective components such as chip fuses.

Method used

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  • A kind of electronic paste for patch fuse fuse and its manufacturing method
  • A kind of electronic paste for patch fuse fuse and its manufacturing method
  • A kind of electronic paste for patch fuse fuse and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A kind of electronic paste, its weight percentage is composed of: silver plated copper powder (average particle diameter 8um, containing silver 10wt%) 60wt%, nanometer silver powder (particle diameter 5~100nm) 21wt%, terpineol 3~15wt%, Ethyl cellulose 5~12wt%, Ba-B-Si glass powder 2~10wt%. Silver-plated copper powder is a mixture of spherical and flake particles in any proportion. (1) Take macromolecular resin and organic solvent in the container according to the above ratio, then put the container into a constant temperature water bath, disperse and stir the resin and solvent for 120 ± 10 minutes, make it fully mixed, the water temperature of the water bath is 80±5°C, and finally an organic carrier solution is obtained; (2) Weigh silver-plated copper powder, nano-silver powder, and low-temperature glass powder in proportion and add them to the organic carrier prepared in step (1), and grind and disperse through a high-speed ball mill, The solid phase powders are unifo...

Embodiment 2

[0028] A kind of electronic paste, its weight percentage is composed of: silver-plated copper powder (average particle diameter 8um, containing silver 10wt%) 55wt%, silver nitrate 30wt%, triethanolamine 0.6wt%, terpineol 3~15wt%, ethyl alcohol Base cellulose 5~12wt%, Zn-B-Si glass powder 2~10wt%. Silver-plated copper powder is a mixture of spherical and flake particles in any proportion. (1) Add terpineol dropwise to triethanolamine, add precursor silver nitrate after stirring for 5 minutes, and ultrasonically disperse for 20 minutes at 30° C.; The preparation method is to obtain an organic carrier solution; (3) the organic carrier solution is prepared according to the preparation method of step (2) in Example 1 to obtain a kind of electronic paste according to the present invention. Finally, fuses were made by traditional thick-film printing process, and the anti-pulse ability and high-temperature life of the product were tested according to the experimental method and equip...

Embodiment 3

[0030] A kind of electronic paste, its weight percentage is composed of: silver plated nickel powder (average particle diameter 10um, containing silver 10wt%) 50wt%, nanometer silver powder (particle diameter 5~100nm) 36wt%, terpineol 3~15wt%, Ethyl cellulose 5~12wt%, Zn-B-Si glass powder 2~10wt%. Silver-plated nickel powder is a mixture of spherical and flake particles in any proportion. An electronic paste according to the present invention was obtained by the preparation method as in Example 1. Finally, fuses were made by traditional thick-film printing process, and the anti-pulse ability and high-temperature life of the product were tested according to the experimental method and equipment described in Example 1. The test results show that the anti-pulse ability of the product using silver-plated nickel powder-based electronic paste is about 50% higher than that of the corresponding product of silver-plated copper powder-based electronic paste, and its anti-pulse ability ...

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Abstract

The invention relates to electronic paste and a preparation method of the electronic paste. The electronic paste comprises, by weight, 30-70% of silver-plated copper powder or silver-plated nickel powder, 0-40% of nano-silver powder, 3-15% of organic solvent, 5-12% of macromolecule resin and 2-10% of inorganic additive. The preparation method of the electronic paste comprises the steps of (1) weighing the macromolecule resin and the organic solvent in proportion, placing the macromolecule resin and the organic solvent into a container, placing the container into a thermostatic water bath, evenly mixing the macromolecule resin and the organic solvent to obtain an organic carrier, and (2) weighing the silver-plated copper powder or the silver-plated nickel powder, the nano-silver powder and the inorganic additives in proportion, adding the silver-plated copper powder or the silver-plated nickel powder, the nano-silver powder and the inorganic additives to the organic carrier obtained in the step (1), carrying out grinding and rolling to meet the requirement of the fineness to achieve even distribution of the solid-phase powder in the organic carrier. The preparation method of the electronic paste is simple, high in production efficiency and low in cost. When the obtained electronic paste is used for printing a fuse link structure of a surface-mount fuse, and compared with traditional silver paste, the pulse resistant capacity is greatly improved.

Description

technical field [0001] The present invention relates to an electronic paste that can be used for printing fuses in patch fuses and a preparation method thereof, in particular to a patch with silver-plated copper powder or silver-plated nickel powder as conductive metal and high pulse resistance Electronic paste for fuse fuse and its preparation method. Background technique [0002] Electronic paste is widely used in the thick-film printed electronic components industry, in which several common metal powders such as gold, silver, copper and nickel with low resistivity are used for the conductive function. The best performance is gold powder, but it is expensive; silver powder has the advantages of relatively low price, good conductivity and strong oxidation resistance, but it will produce electromigration under the action of an electric field, which will reduce its conductivity and affect the product. The service life of copper and nickel powder is cheap, and it will not mig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01H85/06
Inventor 南式荣刘明龙
Owner NANJING SART SCI & TECH DEV
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