Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of copper-based superhydrophobic surface structure

A super-hydrophobic surface, copper-based technology, used in devices for coating liquids on surfaces, special surfaces, pre-treated surfaces, etc., can solve the problems of easy peeling of surface coatings, poor performance, and time-consuming, and achieve the preparation cycle. The effect of shortening, reducing the preparation cost and reducing the production cost

Inactive Publication Date: 2016-01-06
WUHAN UNIV OF TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the method is simple to operate, it takes a long time, and a production cycle needs at least 3 days; the step-by-step method is to first construct a micro-nano hierarchical structure on the surface of metal copper, and then modify it with low surface energy substances to obtain superhydrophobic copper surface method
This method takes a short time, but the surface coating is easy to fall off, and the performance is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of copper-based superhydrophobic surface structure
  • Preparation method of copper-based superhydrophobic surface structure
  • Preparation method of copper-based superhydrophobic surface structure

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] The preparation method of a copper-based superhydrophobic surface structure designed by the present invention, the main steps of the method include:

[0027] The first step is to pre-treat the metal copper substrate;

[0028] In the second step, a layer of photoresist is spin-coated on the surface of the copper substrate processed in the first step, and the photoresist layer attached to the surface of the copper substrate forms an ordered porous array template through photolithography;

[0029] In the third step, the copper substrate with the ordered porous array template prepared in the second step is used as the positive electrode and immersed in CuSO 4 The formation of the primary battery in the solution reacts for 4 to 8 minutes;

[0030] The fourth step, the copper substrate after the reaction of the third step galvanic cell is immersed in AgNO 3 Reaction in solution for 30~70s;

[0031] In the fifth step, the copper substrate after the reaction in the fourth step is subject...

Embodiment 1

[0043] The first step is to immerse the copper substrate in 20mmol / L dilute hydrochloric acid for 20 seconds at room temperature and then take it out. After repeated several times, clean the surface with deionized water, and then use acetone, absolute ethanol, and deionized water for ultrasonic cleaning for 10 minutes. ;

[0044] In the second step, a layer of photoresist is spin-coated on the surface of the copper substrate pretreated in the first step, and an ordered porous array template is formed on the surface of the copper substrate after ultraviolet exposure. The pore size of the ordered porous array template is 8μm and the pitch is 16μm, such as figure 1 Shown

[0045] Step 3: Prepare 0.2mol / L CuSO 4 Solution, seal the part of the copper substrate obtained in the second step that is exposed to the outside and the disordered porous array template, and then use the copper substrate as the positive electrode, and the zinc flake of equal size as the negative electrode, so that ...

Embodiment 2

[0050] The first step is to immerse the copper substrate in 20mmol / L dilute hydrochloric acid for 20 seconds at room temperature and then take it out. After repeated several times, clean the surface with deionized water, and then use acetone, absolute ethanol, and deionized water for ultrasonic cleaning for 10 minutes. ;

[0051] In the second step, a layer of photoresist is spin-coated on the surface of the copper substrate pretreated in the first step, and an ordered porous array template is formed on the surface of the copper substrate after ultraviolet exposure. The pore size of the ordered porous array template is 8μm and the pitch is 12μm, such as figure 1 Shown

[0052] The third step is to prepare 0.5mol / L CuSO 4 Solution, seal the part of the copper substrate obtained in the second step that is exposed to the outside and the disordered porous array template, and then use the copper substrate as the positive electrode and the zinc sheet as the negative electrode, so that th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
pore sizeaaaaaaaaaa
distanceaaaaaaaaaa
contact angleaaaaaaaaaa
Login to View More

Abstract

A manufacturing method for a copper-based super-hydrophobic surface structure mainly includes that step 1, a metal copper base is pre-processed; step 2, a layer of photoresist is coated on the surface of the processed copper base in a rotation mode, and the photoresist layer attached to the surface of the copper base forms a well-aligned porous array template through photoetching processing; step 3, the copper base with the well-aligned porous array template obtained in the step 2 is used as an anode and soaked in a CuSO4 solution to form a primary battery to conduct a reaction for 4-8 min; step 4, the copper base of the primary battery obtained in the step 3 after reaction is finished is soaked into an AgNO3 solution to conduct in-situ reduction for 30-70s; step 5, the copper base subjected to the reaction in the step 4 is subjected to silanization processing, and the copper-based super-hydrophobic surface structure is manufactured. By means of the method, two simple redox processes are utilized to obtain a layer of micro-nano dual-scale structure similar to the lotus leaf surface on the surface of copper metal, hydrophobe is achieved, the performance of the manufactured super-hydrophobic surface is stable, a contact angle between the super-hydrophobic surface and a water solution with a pH value ranging from 1 to 14 can be larger than 155 degrees, and the minimum rolling angle can be smaller than 1.5 degrees.

Description

Technical field [0001] The invention belongs to the technical field of metal substrate surface treatment, and specifically relates to a method for preparing a copper-based superhydrophobic surface structure. Background technique [0002] In nature and in our daily lives, surface wettability is a very important characteristic of solid surfaces. Two key factors affecting surface wettability are obtained by studying the "lotus effect": one is surface free energy (surface chemical Composition), the second is the surface roughness. The surface of super-hydrophobic metal is similar to a lotus leaf. When water droplets are placed on the surface, the water droplets will fall off immediately. It is an important functional material. In recent years, metal super-hydrophobic surfaces (contact angles greater than 150°, rolling angles less than 5°) have received extensive attention and research from all walks of life because of their self-cleaning, drag reduction, friction reduction, and corr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B05D5/08B05D3/10
Inventor 章桥新陈玉雪黄行九
Owner WUHAN UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products