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A kind of conductive paste and its preparation method and printed circuit material

A technology of conductive paste and conductive filler, which is applied to conductive materials, printed circuit components, circuits, etc. dispersed in non-conductive inorganic materials, which can solve the problems that the cost and conductivity cannot be optimized at the same time, and the percolation threshold is high.

Active Publication Date: 2016-07-13
SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, the percolation threshold of the existing conductive paste is relatively high, so that the cost and conductive performance of the existing conductive paste cannot be optimized at the same time

Method used

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  • A kind of conductive paste and its preparation method and printed circuit material
  • A kind of conductive paste and its preparation method and printed circuit material
  • A kind of conductive paste and its preparation method and printed circuit material

Examples

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preparation example Construction

[0030] In this specific embodiment, a method for preparing conductive paste is also provided, which includes the following steps: 1) preparing a polymer resin matrix and a metal powder whose microstructure is a three-dimensional dendritic metal crystal structure; the diameter of the metal crystal structure is 0.5 microns to 50 microns, the length of the secondary dendritic structure is 5 nanometers to 5 microns; 2) Mix the polymer resin matrix and the metal powder to obtain a mixture; 3) Prepare the conductive paste after curing the mixture material.

[0031] Preferably, when mixing in step 2), auxiliary materials such as curing agent and / or catalyst are added and mixed together. In this way, auxiliary materials can be added according to application requirements to improve the performance of the conductive paste. When mixing, a high-speed shear mixer can be used to fully mix the materials.

[0032] Further preferably, step 3) may include step 2) degassing the mixture before ...

Embodiment 1

[0036] The silver metal powder used as conductive filler is prepared, wherein the microscopic structure of the silver metal powder is a three-dimensional dendritic silver dendrite structure, the diameter of the structure is 0.5 microns to 50 microns, and the length of the secondary dendritic structure is 5 nanometers to 5 microns. Mix 2 g of dry three-dimensional dendritic silver dendrite powder with 1.10 g of bisphenol A epoxy resin (EPON828) and 0.89 g of curing agent methyltetrahydrophthalic anhydride (MTHPA) for 15 minutes under high-speed stirring (stirring rate is 1500 rpm). Then 0.01 gram of hexamethylenetetramine used as a catalyst on cure was added and mixing was continued for 5 minutes. The mixture was then degassed for 5 minutes, screen printed, and the samples were cured at 160 °C for 15 minutes. After curing, the conductive paste 1 was prepared, wherein the mass fraction of the silver filler was 2 / (2+1.10+0.89+0.01)=50%. Observing the surface of the conductive p...

Embodiment 2

[0039] The silver metal powder used as conductive filler is prepared, wherein the microscopic structure of the silver metal powder is a three-dimensional dendritic silver dendrite structure, the diameter of the structure is 0.5 microns to 50 microns, and the length of the secondary dendritic structure is 5 nanometers to 5 microns. Mix 2 g of dry three-dimensional dendritic silver dendrite powder with 1.65 g of bisphenol A epoxy resin (EPON828) and 1.32 g of curing agent methyltetrahydrophthalic anhydride (MTHPA) for 15 minutes under high-speed stirring (Stirring rate is 1500 rpm). Then 0.03 grams of hexamethylenetetramine was added as a catalyst on cure and mixing was continued for 5 minutes. The mixture was then degassed for 5 minutes, screen printed, and the samples were cured at 160 °C for 15 minutes. After curing, the conductive paste 2 was prepared, wherein the mass fraction of the silver filler was 2 / (2+1.65+1.32+0.03)=40%. Observing the surface of the conductive paste...

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Abstract

The invention discloses electroconductive slurry and a preparation method thereof, and a printed circuit material. The electroconductive slurry comprises a polymer resin matrix and metal powder which is dispersed in the polymer resin matrix and serves as an electroconductive filler, wherein the microstructure of the metal powder is a three-dimensional dendritic metal crystal structure; the diameter of the metal crystal structure is 0.5-50 microns; a second-stage dendritic structure is 5 nanometers- 5 microns long. According to the electroconductive slurry and the preparation method thereof which are disclosed by the invention, the metal powder with the three-dimensional dendritic metal crystal structure serving as the microstructure is used as the electroconductive filler, so that the percolation threshold value of the electroconductive slurry can be greatly reduced, and the higher electroconductivity can be realized with less metal filler; furthermore, the metal powder with the three-dimensional dendritic metal crystal structure serving as the microstructure is used as the electroconductive filler, so that the electroconductive slurry can keep a high isotropous electroconduction effect and uniform dispersion; due to a nano-end structure, the resistivity of the electroconductive slurry can be greatly reduced, and the electroconductivity can be improved.

Description

【Technical field】 [0001] The invention relates to a conductive paste and a preparation method thereof. 【Background technique】 [0002] At present, conductive pastes have been widely used in applications such as wiring of printed circuit boards, component connections, and the like. The main components of the conductive paste are: conductive filler, such as silver, gold or copper, etc.; resin matrix. Wherein, the conductive filler is in the form of zero-dimensional particles or two-dimensional flakes, such as micron silver flakes. Ordinary granular or flaky metal fillers and bonding resin are evenly mixed in a certain proportion to obtain conductive paste. When the metal powder as a conductive filler is uniformly dispersed in the resin, the composite material can exhibit conductive properties. The resin matrix mainly provides mechanical properties and bonding properties. [0003] In common conductive paste formulations, the content of conductive fillers (such as micron sil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00H05K1/09
Inventor 杨诚崔晓亚张哲旭吴浩怡苏滋津刘静平
Owner SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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