Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Recovery device and recovery method of metallic copper of waste printed circuit board

A printed circuit board and metal copper technology, which is applied in the field of metal copper recovery devices, can solve the problems of high energy consumption and equipment corrosion in the electrolysis process, and achieve the effects of reducing emissions, recycling with low energy consumption, and reducing costs

Inactive Publication Date: 2014-09-24
INNER MONGOLIA UNIV OF SCI & TECH
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The disadvantage of the traditional method of electrolytic recovery of copper is that the electrolysis process consumes a lot of energy, and the acid produced seriously corrodes the equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Recovery device and recovery method of metallic copper of waste printed circuit board
  • Recovery device and recovery method of metallic copper of waste printed circuit board
  • Recovery device and recovery method of metallic copper of waste printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] The process flow of the present invention includes: preparation of metal copper recovery device in waste printed circuit boards, enrichment of electrochemically active microorganisms at the anode of microbial batteries, oxidant Fe 3+ Generation, conversion of metallic copper in waste printed circuit boards to Cu 2+ and Cu 2+ Reduction to metallic copper realizes the recycling of metallic copper. The present invention is further described in conjunction with following example.

[0069] 1. Metal copper recovery device in waste printed circuit boards:

[0070] The structure of metal copper recovery device in waste printed circuit board is as follows: figure 2 As shown, it includes: microbial fuel cell anode chamber 1, carbon fiber brush anode electrode 2, bipolar membrane 3, microbial fuel cell cathode chamber 4, graphite plate cathode electrode 5, wire 6, resistor 7, wire 8, data acquisition system 9, Connecting pipe 10, liquid delivery pump 11, connecting pipe 12, d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a metal copper recovery device and recovery method in waste printed circuit boards. The device comprises a microbial fuel cell, a copper leaching reactor in waste printed circuit boards and a Fe2+ biological oxidation reactor. The recovery method is as follows: first, the iron-oxidizing bacteria in the Fe2+ biological oxidation reactor converts Fe2+ into Fe3+; then the solution containing Fe3+ is input into the copper leaching reactor in the waste printed circuit board, and Fe3+ oxidizes metallic copper to Cu2+, while Fe3+ is reduced Fe2+; Finally, the solution containing Cu2+ is input into the cathode chamber of the microbial fuel cell, Cu2+ is reduced to metallic copper in the cathode chamber of the microbial fuel cell, and the Fe2+ in the cathode chamber of the microbial fuel cell is input into the Fe2+ biological oxidation reactor It is then oxidized to Fe3+. The invention not only reduces energy consumption, but also can obtain electric energy, and at the same time reduces the use of chemical reagents and the pollution of organic waste to the environment.

Description

technical field [0001] The invention relates to a recovery device and recovery method for metal copper in waste printed circuit boards, specifically utilizing microbial fuel cells, metal copper leaching reactors in waste printed circuit boards and Fe 2+ The invention discloses a device and method for recovering metallic copper in waste printed circuit boards by a biological oxidation reactor. Background technique [0002] With the development and progress of human civilization and science and technology, the consumption of mineral resources is increasing day by day. Due to the increasing depletion of high-grade mineral resources, there will be a shortage of resources in the metal production process, which requires people to extract metals from various ores and industrial waste. [0003] In recent years, with the acceleration of the economy and the upgrading of information equipment, the popularity of various electronic products has also increased. At the same time, these el...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C22B7/00C22B3/18C25C1/12C22B15/00
CPCY02P10/20
Inventor 李侠蒋海明张金山
Owner INNER MONGOLIA UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com