Method for processing PCB with step groove

Abstract

The invention discloses a method for processing a PCB with a step groove. The method for processing the PCB with the step groove comprises the step of obtaining of a parent plate, the step of protection of a blind hole for the step groove, the step of copper electroless plating, the step of removal of a protective structure, the step of plating thickening, the step of pasting of dry film, the step of etching and the step of forming of the step groove. Due to the fact that the technological means that a corrosion resistant layer coats the edge of the bottom and the hole wall of the blind hole for the step groove in advance, the protective structure is arranged in a hole opening of the blind hole for the step groove before the copper electroless plating is carried out on the parent plate, the protective structure is removed after the copper electroless plating is finished, etching is carried out on a thickened copper plating layer in the blind hole for the step groove to completely remove the thickened copper plating layer through corrosion resistance of the corrosion resistant layer to alkaline etching liquid, a taper hole is prevented from forming, and finally a compression joint hole applicable to compression joint of an electrical apparatus element is manufactured in the bottom of the step groove is used, damage caused by copper electroless plating chemical liquid is effectively prevented, and the compression joint hole which is applicable to compression joint of the electrical apparatus element is manufactured in the bottom of the step groove. Meanwhile, a graph which is used for circuit connection is arranged at the bottom of the step groove, and the flatness of the plate surface of the parent plate is ensured due to the fact that the protective structure is timely removed.

Description

technical field [0001] The invention relates to the field of PCB board manufacturing, in particular to a method for processing a PCB board with stepped grooves. Background technique [0002] Generally, stepped grooves are provided on the PCB board to accommodate electrical components, so as to prevent the electrical components from protruding out of the circuit board and occupying the external space. Please refer to the invention patent with the Chinese patent application number 200910307869.X, which mainly adopts the method of secondary pressing to produce a PCB board with stepped grooves. Before electroplating, the holes will be filled with insulating resin. Although this method can Avoid the phenomenon that the electroplating solution enters the multilayer printed circuit board from the hole at the bottom of the circuit board to cause corrosion of the hole wall and / or the inner circuit of the printed circuit board, but the insulating resin filled in can only stay in the h...

AI Technical Summary

Problems solved by technology

Please refer to the invention patent with the Chinese patent application number 200910307869.X, which mainly adopts the method of secondary pressing to produce a PCB board with stepped grooves. Before electroplating, the holes will be filled with insulating resin. Although this method can Avoid the phenomenon that the electroplating solution enters the multilayer printed circuit board from the hole at the bottom of the circuit board to cause corrosion of the hole wall and / or the inner circuit of the printed circuit board, but the insulating resin filled in can only stay in the hole, if it is forcibly removed It is easy to damage the PCB board, so the stepped groove made in this way can only be soldered on the surface, that is, the electrical components at the bottom of the stepped groove need to be connected by reflow soldering, which cannot meet the needs of crimping electrical components at the bottom of the stepped groove; and , if reflow soldering is used for PCB boards with a thickness of more than 4mm, the heat resistance of the PCB board material is also a difficult problem to solve, and it is very easy to appear the phenomenon of delamination and explosion.

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