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Chemical copper plating waste solution treatment method

A technology of electroless copper plating and treatment methods, applied in chemical instruments and methods, inorganic chemistry, water/sewage multi-stage treatment, etc., can solve the problems of difficult wastewater purification, high cost, and difficult resource recovery, etc., and achieve good environmental benefits And economic benefits, large environmental benefits and economic benefits, the effect of broad application prospects

Inactive Publication Date: 2013-07-31
东莞道汇环保科技股份有限公司
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Problems solved by technology

[0008] The present invention provides a treatment method for electroless copper plating waste liquid in order to solve the problems of difficult waste water purification, high cost and difficult resource recovery in current electroless copper plating waste liquid

Method used

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Embodiment Construction

[0027] Take 4L of aging electroless copper plating waste liquid from an electroplating factory, and measure the COD in the waste liquid Cr The concentration is 10032mg / L, Cu 2+ content is 5g / L, sodium hypophosphite content is 2.89g / L, sodium phosphite content is 21.29g / L, and total phosphorus is 6.13g / L, waste liquid is filtered, and the granular suspension in the waste liquid is removed, and Put the waste liquid after the above-mentioned filtration into the reactor, adjust the pH value of the waste liquid to make the pH value of the waste liquid 6.0; adding concentration is 30% hydrogen peroxide (making H 2 o 2 The concentration is 10g / L), with cuprous sulfate and copper sulfate (Cu + :Cu 2+ =1:2) As a catalyst, add ultraviolet photocatalysis, stir by mechanical stirring, first turn on the 80W ultraviolet lamp to start the reaction, and carry out oxidative degradation. In actual use, we can also use other oxidation methods to degrade organic matter, such as one or more of...

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Abstract

The present invention relates to the technical field of industrial waste liquid treatments and recoveries, especially to a chemical copper plating waste solution treatment method for degrading organic pollutants in a chemical copper plating waste solution and recovering orthophosphates, wherein an oxidation method is adopted to carry out oxidative decomposition on organic pollutants in the chemical copper plating waste solution, concurrently hypophosphite and phosphate in the waste solution are oxidized into orthophosphate, the orthophosphate and copper ions in the waste solution are subjected to a chemical reaction to produce copper phosphate, the excess orthophosphate is added with metal ions so as to carry out a complete reaction of the orthophosphate and the metal ions in the waste solution to obtain the phosphate, and the obtained copper phosphate and the obtained phosphate are separated from the waste solution, and then are subjected to a drying treatment. The method has the following characteristics that: a chemical copper plating waste solution harmless treatment is achieved, resource recovery is achieved, good environmental benefits and good economic benefits are provided, and application prospects are wide.

Description

technical field [0001] The invention relates to the technical field of industrial waste liquid treatment and recovery, in particular to a treatment method for chemical copper plating waste liquid which degrades organic pollutants in chemical copper plating waste liquid and recovers orthophosphate. Background technique [0002] In electroless plating, electroless copper plating is a very important plating species. With the development of the electronics industry, especially the rapid development of electronic computers, electronic communication equipment, and household appliances, there is a great demand for double-sided and multi-layer printed circuit boards. Electroless copper plating is mainly used in the treatment of PCB surface and holes. It can generate a uniform thickness of copper plating layer on the wires of the PCB hole wall, which greatly improves the performance of printed circuits. Most PCB hole metallization uses electroless copper plating technology rather th...

Claims

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Application Information

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IPC IPC(8): C02F9/04C02F9/08C01B25/37
Inventor 刘鹏陆钢崔海波
Owner 东莞道汇环保科技股份有限公司
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