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Heat radiation material, heat radiation structure, and preparation method thereof

A technology of heat-dissipating materials and heat-dissipating structures, applied in fibrous fillers, polyurea/polyurethane coatings, cooling/ventilation/heating transformation, etc. problems, to achieve the effect of improving lifespan, improving compatibility and system dispersion stability, and effectively dissipating heat

Inactive Publication Date: 2013-07-17
REGAL PAPER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, heat dissipation fillers in heat dissipation coating materials on the market are mainly graphite, carbon nanotubes, etc.; however, the compatibility of the above heat dissipation fillers with polymer materials is poor, and nano heat dissipation materials are easy to aggregate, which seriously affects its thermal conductivity. effect and stability

Method used

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  • Heat radiation material, heat radiation structure, and preparation method thereof
  • Heat radiation material, heat radiation structure, and preparation method thereof
  • Heat radiation material, heat radiation structure, and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0037] In this embodiment, the water-based slurry of inorganic heat-dissipating nanomaterials uses polyvinyl alcohol as a dual-functional macromolecular modifier, and the ester bonds and hydrogen bonds formed on the surface of the nanomaterials of carbon nanotubes are used to obtain a stable and dispersed water-based slurry The solid content of this water-based slurry is 25%, and the particle size of the heat-dissipating nano-carbon is all at 50-100nm, and its components and parts by weight are as follows:

[0038] Heat dissipation nanomaterials: carbon nanotubes (CN) 15

[0039] Deionized water 75

[0040] Polyvinyl alcohol (M W =2000) 10

[0041] Sample 1:

[0042] First take by weighing 15g carbon nanotubes and put into the water of 75g, adjust pH to be 9, under agitation condition, with the speed of 2ml / min, the polyvinyl alcohol of 10g (W W = 2000) dropwise into the above aqueous solution, stirring at room temperature or ultrasonic wave for 10 minutes to 12 hours unti...

Embodiment 2

[0047] The water-based slurry of inorganic heat-dissipating nanomaterials uses polyether-modified silicone as a bifunctional macromolecule modifier, and ester bonds and hydrogen bonds formed on the surface of nanomaterials of carbon nanotubes are used to obtain a stable and dispersed water-based slurry; The solid content of the water-based slurry is 25%, and the particle size of the heat-dissipating nano-carbon is 50-100nm, and its components and parts by weight are as follows:

[0048] Heat dissipation nanomaterials: carbon nanotubes (CN) 15

[0049] Deionized water 75

[0050] Polyether modified organosilane (M W =500) 10

[0051] The specific preparation steps are the same as the preparation method of sample 1 in Example 1.

Embodiment 3

[0053] In the water-based slurry of inorganic heat-dissipating nanomaterials, polyethylene glycol is used as a bifunctional macromolecular modifier, and ester bonds and hydrogen bonds formed on the surface of nanomaterials of carbon nanotubes are used to obtain a stably dispersed water-based slurry; the water-based slurry The solid content of the material is 25%, and the particle size of the heat-dissipating nano-carbon is 50-100nm, and its components and parts by weight are as follows:

[0054] Heat dissipation nanomaterials: carbon nanotubes (CN) 15

[0055] Deionized water 75

[0056] polyethylene glycol (M W =200) 10

[0057] The specific preparation steps are the same as the preparation method of sample 1 in Example 1.

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Abstract

The invention provides a heat radiation material, a heat radiation structure, and preparation methods thereof. The heat radiation material comprises, by weight, 10-30 parts of inorganic heat radiation nano-grade material aqueous slurry, 40-80 parts of aqueous high-molecular resin, 0.5-5 parts of an auxiliary agent, and 5-20 parts of a diluting agent. The inorganic heat radiation nano-grade material aqueous slurry comprises, by weight, 10-25 parts of an inorganic heat radiation nano-grade material, 0.5-20 parts of a bi-functional large-molecular modifier, and 50-100 parts of a solvent. According to the inorganic heat radiation nano-grade material, the bi-functional large-molecular modifier is used in surface modification. Selective absorption and grafting hybridization reaction are carried out on the surface of the inorganic heat radiation nano-grade material, such that coordination self-assembly behaviors of ester bond, silicon-oxygen bond, hydrogen bond, and the like are formed on the surface of the material. Therefore, inorganic heat radiation nano-grade material interface performance is controlled, compatibility and system dispersion stability of the inorganic heat radiation nano-grade material are improved, and better heat radiation performance can be obtained.

Description

technical field [0001] The invention relates to a heat dissipation material and its application, in particular to a heat dissipation material containing inorganic heat dissipation nanomaterial slurry and a preparation method thereof. Background technique [0002] Thermally conductive materials include thermal pad, thermal grease (thermal grease), thermal tape (thermal tape), etc., which are designed to provide the best conditions for heat conduction, and are usually placed on heating elements and heat sinks Between them, it is used to fill the gap between the two, and it is true that the heat is completely conducted from the heating element to the heat sink. It can be applied to various products, such as: notebook computers, desktop computers, motherboards, memory modules DDR, motherboards, hard disks, LED modules, PDP / LCD TVs, etc. Nowadays, the functions of electronic devices are becoming more and more powerful, but the volume is indeed getting smaller and smaller, which ...

Claims

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Application Information

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IPC IPC(8): C09D7/12C09D5/00C09D133/00C09D175/04C09D125/14C09D133/04C09D183/00C09D175/14C09C3/10C09C3/12C09C1/44H05K7/20C09J7/02B32B7/12
Inventor 黄进瑞
Owner REGAL PAPER TECH
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