Preparation technology of copper-clad laminate based on halogen-free flame-retardant resin compositions

Abstract

A preparation technology of a copper-clad laminate based on halogen-free flame-retardant resin compositions comprises the following steps: a fabric glue solution, a glue solution A and a glue solution B are sequentially manufactured; the fabric glue solution is impregnated by 7628 or 2116 glass fabric; solvent is removed in a drying oven to prepare a fabric prepreg; the glue solution A and the glue solution B are sequentially impregnated by wood pulp paper; baking is carried out in the drying oven to prepare a core material prepreg; and finally, two fabric prepregs are respectively pasted on both sides of each of 1-12 core material prepregs, an electrodeposited copper foil is pasted on one side or two sides of each core material prepreg, and the core material prepregs are overlapped and subjected to hot-forming. The copper-clad laminate prepared by adopting the preparation technology has the advantages of low hygroscopicity, high heat resistance, high reliability, high CTI (Comparative Tracking Index), halogen-free and flame-retardant performance, and excellent machinability, and meets the lead-free demand.

Description

technical field [0001] The invention relates to the technical field of manufacturing and processing copper-clad laminates of electronic materials, in particular to a preparation process of a copper-clad laminate based on a halogen-free flame-retardant resin composition. Background technique [0002] CEM-1 type copper clad laminate is made of glass fiber cloth and bleached wood pulp paper as the reinforced base material, which are respectively impregnated with epoxy resin glue to make the fabric and core material, and then covered with copper foil by hot pressing. It has excellent heat resistance, low water absorption, excellent processability, good electrical insulation and mechanical strength, and has the characteristics of low cost and high cost performance. It is mainly suitable for OA equipment, power substrates, LCD TVs, game machines, Household appliances, etc. However, traditional copper-clad laminates for printed circuits mainly use halogen elements for flame retard...

AI Technical Summary

Problems solved by technology

However, the special structure of the P=O group in the phosphorus-containing epoxy resin and phosphate-based flame-retardant substances leads to the formulation having strong hygroscopicity and hydrolysis. Therefore, the introduction of such materials in the formulation makes Under the conditions of strong alkali or high temperature and high humidity (such as in the process of PCB processing), it is very easy to cause delamination and explosion, which seriously affects the service life of the board and the finished product

In addition, the presence of these hygroscopic substances can also lead to a reduction in the service life of electrical equipment produced with copper clad laminates

[0004] At present, in order to solve the problem of high hygroscopicity and explosive board of halogen-free boards, phosphazene flame retardants (see patent CN102020230A) are used. Because of the special chemical structure, P atoms are wrapped in the middle of other atoms. Greatly reduces the hygroscopic properties of flame retardants

However, in order to achieve flame retardancy, this application uses a large amount of phenoxyphosphazene flame retardant in combination with N-type phenolic resins and phosphate esters. Due to the large amount of phenoxyphosphazene flame retardants, it is easy to precipitate, and melamine-modified phenolic Resin and phosphate ester cured products have low heat resistance and high water absorption

As a result, the board is still lacking in heat resistance and moisture absorption performance, especially it cannot meet the current lead-free soldering requirements, and the storage time of the board is short

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