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Packaging process of blue light light-emitting diode (LED) converting to white light through secondary excitation

A technology of secondary excitation and packaging technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of retinal cell damage, high energy, loss, etc., and achieve outstanding substantive features, broad application prospects, and significant technological progress. Effect

Inactive Publication Date: 2013-06-12
XIANGLING LED
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the temperature generated by the working current continues to rise, the luminous energy of the yellow phosphor is reduced. When the device temperature continues to rise > 80 ° C, the luminous efficiency of the phosphor will also drop sharply.
At the same time, the emission peak is wide and short, the blue light excitation peak is high and narrow, the wavelength is short, and the energy is high, which can directly penetrate the lens and reach the retina of the fundus, activate cell oxidation reaction, initiate cell apoptosis, cause retinal cell damage, and cause vision loss even lost

Method used

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  • Packaging process of blue light light-emitting diode (LED) converting to white light through secondary excitation

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Embodiment Construction

[0015] As shown in the figure, the encapsulation process of blue LED secondary excitation to convert white light includes prefabricated LED fluorescent lampshade, blue LED chip, YAG yellow phosphor, and substrate, and is characterized in that: the YAG yellow phosphor and blue LED chip Stacked from top to bottom and placed in a prefabricated LED fluorescent lampshade, and consolidated with the substrate together with the lower plane of the prefabricated LED fluorescent lampshade.

[0016] The blue LED chip is a single-electrode chip with a vertical structure.

[0017] The substrate is provided with a positive electrode area and a negative electrode area; and the substrate is a ceramic substrate, a copper alloy substrate or an aluminum alloy substrate.

[0018] A viscose-type filler or gel is placed between the blue LED chip and the YAG yellow fluorescent powder, and between the blue LED chip and the substrate.

[0019] The blue LED chip is coated with YAG yellow phosphor, so t...

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Abstract

A packaging process of blue light light-emitting diode (LED) converting to white light through secondary excitation includes prefabricating LED fluorescence lamp cover, a blue light LED chip, yttrium aluminum garnet (YAG) yellow fluorescent powders and a substrate. The YAG yellow fluorescent powders and the blue light LED chip are stacked into a whole from top to bottom, and placed in the prefabricated LED fluorescence lamp cover, and the YAG yellow fluorescent powders and the blue light LED chip, the lower plane of the prefabricated LED fluorescence lamp cover and the substrate are fixedly combined into a whole. The packaging process of the blue light LED converting to the white light through the secondary excitation has the advantages that on the basis that the YAG yellow fluorescent powders are aroused by the blue light LED chip to be converted to the white light, the YAG yellow fluorescent powders are aroused for the second time to emit compound white light, the LED white light is soft and even in light ray, blue light radiation is effectively reduced, meanwhile the appearance of the lamp cover is yellow, and the yellow fluorescent powder coating film obtained through the method of electrostatic painting in the lamp cover has rubbing and scraping resistant strength, and not prone to stripping when an LED lamp cover shell is packaged.

Description

technical field [0001] The invention relates to a packaging structure for LED lighting, in particular to a packaging process for secondary excitation of a blue LED to convert white light, and belongs to the technical field of LED lighting production. Background technique [0002] At present, the most widely used and mature white light LED packaging technology is a fixed blue light chip covered with YAG yellow phosphor powder. As the temperature generated by the working current continues to rise, the luminous energy of the yellow phosphor is reduced. When the temperature of the device continues to rise >80°C, the luminous efficiency of the phosphor will also drop sharply. At the same time, the emission peak is wide and short, the blue light excitation peak is high and narrow, the wavelength is short, and the energy is high, which can directly penetrate the lens and reach the retina of the fundus, activate cell oxidation reaction, initiate cell apoptosis, cause retinal cell...

Claims

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Application Information

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IPC IPC(8): H01L33/50
Inventor 吴政明朱德德巩仕星徐颖
Owner XIANGLING LED
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